Semiconductor Package Warpage Mitigation via Localized Pressure
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Solution Overview
Problem
The existing fabrication methods of semiconductor packages face challenges with warpage of the encapsulant during the curing process, leading to misalignment of the Redistribution Layer (RDL) structure with semiconductor elements, which reduces product reliability and yield, especially as the carrier size increases.
Innovation Solution
A method involving a carrier with a pressure area around the semiconductor elements, where a pressure member is placed after carrier removal to support the encapsulant, maintaining structural flatness and enabling precise alignment of the RDL structure with the semiconductor elements, thereby improving reliability and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large carrier is used to support the encapsulant during curing, then the encapsulant can be properly cured, but warpage occurs on the edges of the encapsulant after carrier removal
Solution Approach 1:
The patent applies preliminary action by defining a pressure area around the semiconductor element during encapsulant formation, and then applying pressure to this specific area after carrier removal. This pre-planned pressure application prevents warpage before it occurs, rather than trying to correct it afterward. The pressure area is prepared in advance during encapsulant formation, enabling targeted pressure application that maintains flatness without affecting the overall curing quality.
Solution Approach 2:
The patent applies local quality by concentrating pressure application to a specific pressure area surrounding the semiconductor element, rather than applying pressure uniformly across the entire encapsulant. This localized pressure approach addresses warpage at the edges where it occurs most severely, while maintaining the flatness of the central area where the semiconductor element is located. The pressure member is specifically positioned to apply force only to the problematic edge regions.
2Productivity
If the carrier size is increased to support larger semiconductor elements, then more elements can be processed, but the position tolerance between semiconductor elements deteriorates
Solution Approach 1:
The patent applies local quality by maintaining a consistent pressure area size around each semiconductor element regardless of the overall carrier size. This ensures that each element receives appropriate localized support and pressure, maintaining position tolerance and alignment precision. The pressure member is positioned to apply force only to the immediate vicinity of each semiconductor element, ensuring that elements remain properly aligned even when processed in large arrays on extended carriers.
3Shape
If pressure is applied to the encapsulant after carrier removal, then warpage is reduced, but the structural integrity must be maintained
Solution Approach 1:
The patent applies local quality by concentrating pressure application to a specific pressure area around the semiconductor element rather than applying pressure across the entire encapsulant surface. This localized approach reduces warpage in the critical edge regions while minimizing stress on the overall encapsulant structure. The pressure member is designed to apply force only where needed (at the edges and around the semiconductor element) without compromising the structural integrity of the central encapsulated region.
Data Source
AI summary
A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a carrier; disposing at least a semiconductor element on the carrier; forming an encapsulant on the carrier and the semiconductor element for encapsulating the semiconductor element; removing the carrier; disposing a pressure member on the encapsulant; and forming an RDL structure on the semiconductor element and the encapsulant, thereby suppressing internal stresses through the pressure member so as to mitigate warpage on edges of the encapsulant.