Semiconductor Package Prism Structure for Optical Die Interconnect
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Solution Overview
Problem
Existing methods for fabricating semiconductor packages with prism structures for optical signaling are not entirely satisfactory in terms of efficiency and optical signal transmission.
Innovation Solution
The formation of a semiconductor package involves a wafer level packaging process where a first and second die stack structure are laterally spaced and encapsulated with an insulating encapsulation. A redistribution structure with prism structures and reflectors is formed to facilitate optical communication between the die stack structures and an optical signal source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional fabrication methods are used for semiconductor packages, then manufacturing simplicity is maintained, but optical signal transmission efficiency is insufficient
Solution Approach 1:
The package structure is segmented into distinct functional modules: photonic die for optical signal generation/detection, electronic die for electrical processing, and prism structures for optical beam manipulation. This segmentation allows each component to be optimized independently while working together to achieve high-speed optical signal transmission.
Solution Approach 2:
Prism structures serve as intermediary components between the optical fiber and photonic die, manipulating light beams through refraction and reflection. These intermediary elements enable efficient optical coupling while maintaining the separation between optical and electrical domains, thus improving transmission efficiency without requiring direct contact between components.
2Reliability
If prism structures are added to facilitate optical communication, then optical signal transmission is improved, but manufacturing complexity increases
Solution Approach 1:
The prism structures are merged with the packaging substrate to form an integrated optical interface. By combining the prism functionality with the existing package substrate, the patent eliminates the need for separate prism components and their associated alignment procedures, thereby improving optical signal transmission while maintaining ease of manufacture.
Solution Approach 2:
The prism structures are pre-formed and integrated into the packaging substrate before die attachment. This preliminary action ensures precise optical alignment is built into the substrate itself, eliminating the need for complex post-assembly alignment procedures and simplifying the overall fabrication process while ensuring reliable optical signal transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient optical signal transmission and intercommunication between the die stack structures, improving the overall performance of semiconductor packages in optical signaling applications.
Implementation Method 1
a prism structure receives light beam from an optical fiber and refracts it to a coupling region in the P-die
Data Source
AI summary
A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die. The at least one reflector is disposed on the at least one prism structure.