Semiconductor Package Z-Dimension Reduction via Protection Layer
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Solution Overview
Problem
The challenge is to create a semiconductor device with reduced thickness while minimizing manufacturing time and cost, as thinner devices are more fragile and require time-consuming processes that increase costs and reduce throughput.
Innovation Solution
A method involving forming a protection layer over semiconductor die, depositing an encapsulant, removing a portion of the encapsulant to expose bumps, and forming a conductive layer over the bumps and encapsulant, which supports the die during backgrinding and reduces fragility, allowing for a reduced z-dimension without increasing susceptibility to damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the thickness of the semiconductor die is reduced to decrease package height, then the z-dimension of the package is reduced, but the semiconductor die becomes more fragile and susceptible to damage
Solution Approach 1:
A protection layer is formed over the semiconductor die before packaging to provide structural support during subsequent manufacturing processes. This preliminary protective measure allows the die to be thinned without compromising its strength, as the protection layer compensates for the reduced die thickness and prevents damage during handling and processing.
2Length of stationary object
If traditional thinning processes are used to reduce die thickness, then the package z-dimension is reduced, but manufacturing time increases and throughput decreases
Solution Approach 1:
The protection layer formation is combined with the packaging process, allowing both functions to be achieved in a single integrated workflow. The protection layer serves dual purposes: protecting the thinned die and serving as part of the final package structure, thereby eliminating separate thinning and protection steps that would otherwise increase manufacturing time.
3Volume of moving object
If the semiconductor die is thinned to reduce package size, then the footprint is reduced, but the manufacturing cost increases due to time-consuming processes
Solution Approach 1:
The protection layer is designed to be self-forming through standard deposition processes, eliminating the need for complex, costly manual intervention or specialized equipment. The layer automatically provides the necessary protection during die thinning and packaging, making the cost-effective reduction of package volume achievable through routine manufacturing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a robust semiconductor device with a reduced z-dimension, enhancing its durability and reducing manufacturing time and costs by minimizing the risk of damage during processing.
Implementation Method 1
depositing an encapsulant over the first semiconductor die
Data Source
AI summary
A semiconductor device has a plurality of first semiconductor die. A plurality of first bumps is formed over the first semiconductor die. A first protection layer is formed over the first bumps. A portion of the first semiconductor die is removed in a backgrinding operation. A backside protection layer is formed over the first semiconductor die. An encapsulant is deposited over the first semiconductor die and first bumps. A portion of the encapsulant is removed to expose the first bumps. A conductive layer is formed over the first bumps and encapsulant. An insulating layer and plurality of second bumps are formed over the conductive layer. A plurality of conductive vias is formed through the encapsulant. A plurality of the semiconductor devices is stacked with the conductive vias electrically connecting the stacked semiconductor devices. A second semiconductor die having a through silicon via is disposed over the first semiconductor die.