Semiconductor Package Protruding Resin Edge for Tray Transport
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Solution Overview
Problem
Semiconductor packages without sealing resin are prone to chipping and dust generation during transportation due to contact with tray walls, and existing solutions require additional processing steps, affecting productivity.
Innovation Solution
A semiconductor package with a multilayer structure featuring a synthetic resin layer that protrudes outward, positioned between a glass and silicon layer, and a transport tray design with slightly larger storage parts to accommodate the package, preventing contact and dust generation without adding new processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the semiconductor package size is reduced to chip size without sealing resin, then production efficiency and miniaturization are improved, but the package becomes prone to chipping and dust generation during transportation
Solution Approach 1:
The invention adds a protective resin layer that protrudes from the end face of the chip in the vertical dimension, creating a protective barrier without increasing the horizontal footprint of the package. This allows the chip size to remain minimal while providing transportation protection.
Solution Approach 2:
The protective resin layer is formed during the packaging process before transportation, protruding in advance to prevent contact between the chip end face and tray walls during subsequent handling and transport operations.
2Reliability
If sealing resin is added to protect the semiconductor chip, then chip protection is improved, but the package size increases and productivity decreases
Solution Approach 1:
Instead of applying sealing resin over the entire chip surface, the invention applies resin locally only at the end face region that requires protection during transportation. This localized approach provides necessary protection while minimizing material usage and package size increase.
Solution Approach 2:
The protective resin layer functions as a thin film extension that protrudes from the chip end face, providing a flexible protective barrier against mechanical contact without requiring a complete sealing structure.
3Area of stationary object
If the semiconductor package is stored in a tight-fitting tray, then space utilization is improved, but the package end face contacts the tray wall causing dust generation and chipping
Solution Approach 1:
The protruding protective resin layer acts as a beforehand cushion that prevents direct contact between the chip end face and the tray wall. This cushioning layer absorbs mechanical contact during transportation, preventing dust generation and chipping while allowing tight-fitting tray storage.
Data Source
AI summary
When a semiconductor package is stored in a transport tray and when a semiconductor package is transported by a transport tray, the semiconductor package comes into contact with the side wall of the transport tray, so that the end face of the semiconductor package is chipped and dust is generated from the end face of the semiconductor package. Provided is a technology for a semiconductor package that includes a multilayer structure having at least a synthetic resin layer and includes an outermost edge portion such that the end face of the synthetic resin layer protrudes outward compared to the end faces of the other layers constituting the multilayer structure.