Semiconductor Package Protruding Solder Resist for Resin Filling
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Solution Overview
Problem
Existing semiconductor packages face challenges in filling resin between the back surface of a semiconductor chip and a second substrate due to the need for further thinning and the difficulty in accessing this gap during the resin filling process, especially when the structure is pressed from the top and bottom.
Innovation Solution
A semiconductor package design that includes a second substrate with a solder resist layer having protruding portions on its surface facing the back surface of the semiconductor chip, allowing for easier resin filling between the chip and the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the gap between the back surface of the semiconductor chip and the second substrate is narrowed to achieve further thinning, then the thickness of the semiconductor package is reduced, but it becomes difficult to fill the resin between the back surface of the semiconductor chip and the second substrate
Solution Approach 1:
The protruding portions are formed on the second substrate before the resin filling process. This preliminary structural preparation creates predetermined spaces that allow resin to be easily filled between the back surface of the semiconductor chip and the second substrate, even when the overall gap is narrow, thus resolving the contradiction between package thinning and resin filling ease
2Productivity
If the structure is pressed from the top and bottom by a die during resin filling, then the resin is forced into the gap, but the gap is further narrowed and it becomes difficult to fill the resin between the back surface of the semiconductor chip and the second substrate
Solution Approach 1:
The second substrate is segmented by forming multiple protruding portions that create localized spaces. These segmented spaces allow resin to be filled from multiple locations simultaneously, improving filling efficiency while preventing complete gap closure during pressing, thus resolving the contradiction between filling efficiency and filling ease
Data Source
AI summary
A semiconductor package includes: a first substrate; a semiconductor chip mounted on the first substrate such that a circuit formation surface is oriented toward the first substrate; a second substrate arranged above the first substrate, the semiconductor chip being sandwiched between the first substrate and the second substrate; and a resin that seals the semiconductor chip and that is filled between the first substrate and the second substrate, wherein the second substrate includes a solder resist layer having a first surface facing a back surface that is an opposite surface of the circuit formation surface of the semiconductor chip, and wherein on an area of the first surface of the solder resist layer facing the back surface of the semiconductor chip, at least one protruding portion that protrudes towards the back surface of the semiconductor chip is provided.