Semiconductor Package RDL Descum for Short and Delamination Control
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Solution Overview
Problem
Existing semiconductor packaging techniques face challenges in achieving high integration density and component density while minimizing electrical shorts and stress-related issues such as delamination and cracking, particularly in Package-on-Package (PoP) technology.
Innovation Solution
The use of a point-of-reference (POR) descum process and an enhanced low-pressure descum process to treat polymer layers in redistribution structures, which results in higher surface roughness and lower reflectivity, improving sidewall profiles and reducing bridging issues, thereby enhancing device performance and production throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional packaging techniques are used to achieve high integration density, then component density improves, but electrical shorts and stress-related issues (delamination and cracking) increase
Solution Approach 1:
The patent applies descum processes that modify the surface parameters of polymer layers, specifically increasing surface roughness and decreasing reflectivity. These parameter changes in the polymer layer surface properties reduce electrical shorts and stress-related failures while maintaining high component density in PoP packages
2Manufacturing precision
If polymer layers are treated with descum processes to reduce electrical shorts, then manufacturing precision improves, but production throughput may decrease due to additional processing steps
Solution Approach 1:
The descum processes are performed at predetermined stages during the redistribution structure formation process, before subsequent layers are deposited. This preliminary treatment of polymer layer surfaces ensures optimal adhesion and overlay control for subsequent layers, preventing defects that would require rework and actually improving overall production efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described processes achieve better overlay control, reduce stress-related issues, and improve production throughput by addressing electrical shorts and delamination in semiconductor packages, leading to improved device performance and yield.
Implementation Method 1
The use of a point-of-reference (POR) descum process and an enhanced low-pressure descum process to treat polymer layers in redistribution structures
Data Source
AI summary
A method of forming a semiconductor package includes: surrounding a die with a molding material; and forming a redistribution structure (RDS) over the molding material and electrically coupled to the die, which includes: depositing a first dielectric layer over the molding material; patterning the first dielectric layer to form first openings in the first dielectric layer; performing a first descum process to clean the first openings; after performing the first descum process, forming a first redistribution layer (RDL) on the first dielectric layer; depositing a second dielectric layer over the molding material; patterning the second dielectric layer to form second openings in the second dielectric layer; performing a second descum process to clean the second openings, where the first and second descum processes are performed under different process conditions; and after performing the second descum process, forming a second RDL on the second dielectric layer.