Semiconductor Package Recess for Multi-Die Integration
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently integrating multiple semiconductor dies and devices into a single package structure while maintaining high yield and reducing costs, particularly in the verification and testing of 3D packaging and 3DIC devices.
Innovation Solution
A manufacturing method involving a carrier with a debond layer and buffer layer, where semiconductor dies are placed and encapsulated, followed by the formation of a redistribution circuit structure with a recess to house a semiconductor device, enhancing electrical connections and heat dissipation, and using underfill materials to improve bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor dies are integrated into a single package structure, then device functionality and performance are improved, but manufacturing complexity and verification difficulty increase
Solution Approach 1:
The package structure is divided into distinct functional layers including carrier substrate, buffer layer, debond layer, and encapsulation layer. Each layer performs specific functions and can be processed independently, simplifying the manufacturing of complex multi-die packages by breaking down the overall structure into manageable segments that can be fabricated and verified separately before final assembly.
2Productivity
If verification and testing are performed at wafer level, then productivity and yield are improved, but measurement precision and detection difficulty increase
Solution Approach 1:
A carrier substrate with buffer layer and debond layer serves as an intermediary platform that holds multiple semiconductor dies in a fixed array configuration. This intermediary structure enables wafer-level processing and verification by providing a stable, standardized interface for applying test structures and measurement equipment, while the modular layer design allows individual dies to be accessed and tested independently if needed.
3Reliability
If redistribution circuit structure with recess is formed, then electrical connectivity and heat dissipation are improved, but manufacturing precision requirements increase
Solution Approach 1:
The recess structure is formed in the encapsulation layer before the semiconductor dies are mounted onto the carrier. This preliminary formation of the recess allows for precise positioning and alignment to be established in advance, creating a predetermined accommodation space that guides subsequent die placement and bonding operations, thereby reducing the precision demands on later manufacturing steps while ensuring proper electrical and thermal contact.
Data Source
AI summary
A package structure includes a first semiconductor die, a second semiconductor die, a redistribution circuit structure, and a semiconductor device. The redistribution circuit structure has a first surface and a second surface opposite to the first surface, where the first surface is in contact with the first semiconductor die and the second semiconductor die, and the redistribution circuit structure is disposed on and electrically connected to the first semiconductor die and the second semiconductor die. The redistribution circuit structure includes a recess extending from the second surface toward the first surface. The semiconductor device is located in the recess and electrically connected to the first semiconductor die and the second semiconductor die through the redistribution circuit structure.