Semiconductor Package Layout With Recessed Control Connection

Solution Overview

Problem

Existing semiconductor devices face challenges in efficiently managing electrical connections and heat dissipation, particularly in the integration and packaging of semiconductor chips, which can lead to inefficiencies and potential reliability issues.

Innovation Solution

The semiconductor device incorporates a novel design with output and control conductive patterns, including recessed structures for improved electrical connections and a heat dissipation base plate with superior thermal conductivity, along with specific materials and bonding methods to enhance performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If semiconductor chips are integrated with conductive patterns in a compact arrangement, then device miniaturization and integration density are improved, but electrical connection reliability and heat dissipation efficiency deteriorate

Engineering Contradiction:

Improveintegration densityVSAvoidelectrical connection reliability

Core Design Contradiction:

Area of moving objectVSReliability

Solution Approach 1:

The conductive pattern is segmented into multiple functional regions: a first conductive pattern for power supply, a second conductive pattern for signal transmission, and a third conductive pattern for heat dissipation. This segmentation allows each region to be optimized independently, maintaining electrical connection reliability while achieving compact integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An insulating layer is introduced as an intermediary between different conductive patterns and between the conductive patterns and the semiconductor chip. This insulating layer prevents electrical interference and short circuits, ensuring reliable electrical connections in the compact integrated structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Area of moving object

If semiconductor chips are integrated with conductive patterns in a compact arrangement, then device miniaturization and integration density are improved, but heat dissipation efficiency deteriorates

Engineering Contradiction:

Improveintegration densityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Area of moving objectVSTemperature

Solution Approach 1:

The conductive pattern is segmented into multiple functional regions: a first conductive pattern for power supply, a second conductive pattern for signal transmission, and a third conductive pattern for heat dissipation. This segmentation allows each region to be optimized independently, maintaining electrical connection reliability while achieving compact integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An insulating layer is introduced as an intermediary between different conductive patterns and between the conductive patterns and the semiconductor chip. This insulating layer prevents electrical interference and short circuits, ensuring reliable electrical connections in the compact integrated structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If complex conductive patterns and multiple components are integrated, then device functionality is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvedevice functionalityVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Multiple functional patterns (power supply, signal transmission, and heat dissipation) are merged into a single integrated conductive structure formed by sequential deposition and patterning processes. This reduces the number of separate components and assembly steps, simplifying manufacturing while maintaining full device functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The conductive pattern structure is designed to serve multiple functions simultaneously: electrical connection, signal transmission, and heat dissipation. This multi-functionality reduces the need for separate dedicated structures, thereby reducing overall manufacturing complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250329628A1Semiconductor device

Publication Date: 2025.10.23 FUJI ELECTRIC CO LTD

AI summary

A semiconductor device, including: an output conductive pattern having: a first part, having first and second sides extending in a first direction, and third and fourth sides extending a in second direction perpendicular to the first direction, and a second part, having first and second sides extending in the first direction, and a third side extending in the second direction, the third side of the second part being joined to third side of the first part; a first semiconductor chip disposed in the first part and including a control electrode provided on a front surface thereof; an output terminal disposed in the second part; and a control conductive pattern including a connection part electrically connected to the control electrode. The second part has a recess on the first side thereof and is recessed from the first side. The connection part is provided in the recess.