Semiconductor Package Recessed Lateral Side for Thin Mounting
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving reduced thickness and defect-free mounting of semiconductor chips, particularly due to limitations in design and material contact during the miniaturization and high-capacity demands of electronic products.
Innovation Solution
A semiconductor package design featuring a lower structure with an upper insulating layer and pad, and a semiconductor chip with a lower insulating layer and pad, where the lateral side of the chip has a recessed portion, allowing direct contact and coupling between the layers and pads to reduce thickness and prevent defects during mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional semiconductor package design is used, then mounting process is simpler, but package thickness cannot be reduced and defects occur during mounting
Solution Approach 1:
The recessed portion is formed in advance on the lateral side of the semiconductor chip before mounting. This preliminary structural preparation allows the chip to be properly received and positioned in the package cavity, preventing mounting defects while enabling reduced package thickness.
Solution Approach 2:
The recessed portion acts as an intermediary structural feature that facilitates proper contact and positioning between the semiconductor chip and the package structure. It mediates the interface between chip and package, ensuring reliable mounting while allowing thickness reduction.
2Length of moving object
If package thickness is reduced, then miniaturization is achieved, but mounting defects increase
Solution Approach 1:
The recessed portion is pre-formed on the chip lateral side to establish proper positioning geometry before mounting occurs. This advance preparation ensures that even in reduced-thickness packages, the chip aligns correctly with the package cavity, maintaining manufacturing precision.
Solution Approach 2:
The recessed portion creates a localized structural feature on the chip that provides precise positioning information. This local geometric modification ensures accurate mounting without requiring the entire package structure to be more complex, thus maintaining precision while reducing overall thickness.
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes a lower structure including an upper insulating layer and an upper pad; and a semiconductor chip provided on the lower structure and comprising a lower insulating layer and a lower pad. The lower insulating layer is in contact with and coupled to the upper insulating layer and the lower pad is in contact with and coupled to the upper pad, and a lateral side of the semiconductor chip extends between an upper side and a lower side of the semiconductor chip and comprises a recessed portion.