Semiconductor Package With Recessed Sensor Chip For Rigidity
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Solution Overview
Problem
Conventional semiconductor packages for acceleration sensors face challenges in reducing thickness while maintaining rigidity and minimizing strain on the base plate, which affects the accuracy of acceleration measurements due to the thickness of the sensor chip and the rigid base plate.
Innovation Solution
The semiconductor package design includes a base plate with a chip installation hole for the sensor chip, maintaining base plate thickness and rigidity, and outer terminals positioned away from the sensor chip installation region to prevent external forces from directly affecting the sensor chip, allowing for a thinner package without altering the sensor chip's thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the base plate is made thin to reduce the thickness of the semiconductor package, then the thickness of the semiconductor package is reduced, but the base plate becomes less rigid and may be strained under heat or external force
Solution Approach 1:
The sensor chip is installed within a recess (chip installation hole) formed in the base plate. This nesting structure allows the sensor chip to be embedded in the base plate, reducing the overall package thickness while the base plate maintains its structural integrity and rigidity through the recess design.
Solution Approach 2:
The base plate has different thicknesses in different regions: it is thinner in the chip installation hole region to accommodate the sensor chip and reduce overall package thickness, while maintaining sufficient thickness in other regions to ensure structural rigidity and resistance to strain.
2Length of moving object
If the thickness of the sensor chip is reduced, then the height of the chip accommodation space can be reduced, but the plump bob requires specific weight to improve measurement accuracy
Solution Approach 1:
Instead of reducing the sensor chip thickness to reduce package thickness, the invention inverts the approach by embedding the sensor chip in a recess of the base plate. This allows the base plate thickness to be optimized for rigidity while the recess depth accommodates the sensor chip, achieving package thinning without compromising sensor chip dimensions or measurement accuracy.
3Ease of manufacture
If outer terminals are provided on the front surface of the base plate, then electrical connection is simplified, but external forces from mounting board are directly applied to the sensor chip
Solution Approach 1:
The outer terminals are extracted from the front surface and relocated to the back surface of the base plate, specifically positioned in regions corresponding to sidewalls. This separation removes the direct transmission path of external mounting forces from the sensor chip while maintaining electrical connection functionality through the base plate's conductive structure.
Data Source
AI summary
A semiconductor package includes a base plate; a sidewall provided at a periphery of the base plate; a sensor chip retained in a chip accommodation space defined by the sidewall; and a chip installation hole provided in the base plate for installing the sensor chip. The sensor chip is disposed in the chip installation hole provided in the base plate of the case. Accordingly, it is possible to reduce a thickness of the semiconductor package without changing a thickness of the sensor chip. The base plate has a relatively large thickness except for the chip installation hole. Accordingly, even when the semiconductor package is made thinner, rigidity of the base plate is maintained, thereby minimizing a strain in the base plate.