Semiconductor Package With Recessed Substrate Mold Layer
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Solution Overview
Problem
The challenge in semiconductor packaging is to create a compact, high-capacity, and multifunctional package while maintaining the slimness of electronic devices, which requires innovative methods to form a mold layer between semiconductor packages effectively.
Innovation Solution
The solution involves forming recesses in the edges of a substrate of the upper semiconductor package, allowing a mold layer to fill these recesses and protrude inward, effectively creating a structural connection between the lower and upper semiconductor packages, and using solder balls for electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips are integrated into one package to achieve high capacity and miniaturization, then the functional capability and capacity increase, but the structural complexity and difficulty of forming mold layers increase
Solution Approach 1:
The substrate is divided into multiple regions with different heights by forming recesses at the edges, creating segmented zones that accommodate different components (semiconductor chips, mold layers, solder balls) in a structured manner. This segmentation enables complex multi-chip integration while maintaining organizational order and facilitating the molding process.
Solution Approach 2:
The invention transitions from a two-dimensional planar substrate to a three-dimensional structured substrate by forming recesses that create height differences. This dimensional change allows the mold layer to be positioned at different elevations, enabling effective molding between stacked semiconductor packages while accommodating multiple chips vertically and horizontally.
2Length of stationary object
If the thickness of the semiconductor package is reduced to maintain device slimness, then the package becomes thinner, but the space available for forming mold layers and accommodating components is reduced
Solution Approach 1:
The mold layer is nested within the recesses formed in the substrate edges, utilizing the vertical space created by the recess structures. This nesting approach allows the mold layer to be accommodated within the package thickness without requiring additional external space, effectively packing the mold material into the available volume defined by the recesses.
Solution Approach 2:
By creating recesses that extend vertically into the substrate, the invention transforms the available space from a flat two-dimensional plane to a three-dimensional volume with varying heights. This allows the mold layer to occupy the vertical dimension within the recesses, effectively utilizing the package thickness while maintaining the required mold layer volume.
3Ease of manufacture
If recesses are formed in the substrate edges to accommodate the mold layer, then the mold layer can be effectively formed between packages, but the manufacturing process complexity increases
Solution Approach 1:
The recesses are formed in the substrate edges before the semiconductor chips are mounted and before the mold layer is applied. This preliminary formation of the recess structure prepares the substrate in advance, creating predetermined spaces that guide the subsequent molding process and ensure proper positioning of the mold layer without requiring complex real-time adjustments.
Solution Approach 2:
The recesses are formed only at specific locations (edges) of the substrate rather than uniformly across the entire substrate. This localized modification provides the necessary structural features for mold layer accommodation only where required, maintaining the simplicity of the substrate in other regions and reducing overall fabrication complexity.
Data Source
AI summary
A semiconductor package includes a first substrate, a first semiconductor chip disposed on the first substrate, a second substrate disposed on the first semiconductor chip, a second semiconductor chip disposed on the second substrate, and a mold layer disposed between the first substrate and the second substrate. The second substrate includes a recess formed at an edge, the mold layer fills the recess, and the recess protrudes concavely inward from the edge of the second substrate toward a center of the second substrate.