Semiconductor Package Redistribution Layer Surface Roughness
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Solution Overview
Problem
In fan-out semiconductor packages, the high copper foil remaining ratio in grounded regions leads to reduced adhesion with insulating layers, causing interlayer delamination and stability issues due to the redistribution of connection terminals.
Innovation Solution
The semiconductor package incorporates a redistribution layer with conductive patterns of varying surface roughness, where the ground pattern has a higher surface roughness and wider width than the signal pattern, and features an irregular or regular concave-convex structure to enhance coupling force with the insulating layer, improving structural stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the copper foil remaining ratio in grounded regions is increased, then the electrical conductivity and heat dissipation performance are improved, but the adhesion with insulating layer is reduced causing interlayer delamination
Solution Approach 1:
The patent applies different surface roughness characteristics to different conductive patterns based on their function. Ground patterns have higher surface roughness (improved adhesion for thermal/electrical regions) while signal patterns have lower surface roughness (maintained for electrical performance). This local differentiation resolves the contradiction by optimizing each region's properties according to its specific requirements.
Solution Approach 2:
The patent changes the surface roughness parameter of conductive patterns to control adhesion. By increasing surface roughness of ground patterns, the adhesion area with insulating layers is increased, thereby improving coupling force and preventing delamination while maintaining high copper foil remaining ratio for electrical conductivity and heat dissipation.
2Volume of moving object
If connection terminals are redistributed outwardly to achieve compact size, then the package size is reduced, but the structural stability is compromised
Solution Approach 1:
The patent differentiates surface roughness characteristics between ground patterns and signal patterns. Ground patterns have higher surface roughness to enhance adhesion and structural stability, while signal patterns maintain lower surface roughness. This local quality differentiation allows compact redistribution of terminals while maintaining overall structural stability through enhanced adhesion in critical ground regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the coupling force between the redistribution layer and the insulating layer, reducing damage and improving the structural stability and reliability of the semiconductor package, allowing for more efficient redistribution of connection terminals and better thermal and electrical characteristics.
Implementation Method 1
adhesion with an insulating layer is lowered, and as a result, there may be problems such as interlayer delamination
Data Source
AI summary
A semiconductor package includes a semiconductor chip, and a connection structure disposed on at least one side of the semiconductor chip, and including an insulating layer and a redistribution layer electrically connected to the semiconductor chip, wherein the redistribution layer includes a plurality of conductive patterns, and at least two of the plurality of conductive patterns have different degrees of surface roughness, and a conductive pattern having a higher surface roughness has a width wider than a width of a conductive pattern having a lower surface roughness.