Semiconductor Package Integration via Redistribution Structures
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Solution Overview
Problem
Current methods for mounting a chip equipped with a laser die on a substrate for optical data transmission face challenges in efficient integration and packaging, which affects the performance and reliability of photonic integrated circuits (PICs) and semiconductor packages.
Innovation Solution
The manufacturing method involves forming optical modulators and waveguides over a substrate, using vias and passivation layers, and integrating a laser die with an electronic integrated circuit (EIC) and high-performance integrated circuit (HIC) through redistribution structures and molding compounds, enabling optical and electrical connections for efficient data transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional mounting methods are used for integrating laser die on substrate, then manufacturing simplicity is maintained, but integration efficiency and packaging quality deteriorate
Solution Approach 1:
The patent divides the integration process into distinct stages: forming optical modulators and waveguides on substrate, mounting laser die separately, creating redistribution structures, and final packaging. This segmentation allows each component to be optimized independently while maintaining overall manufacturing efficiency
Solution Approach 2:
The patent performs preliminary actions by pre-forming optical modulators and waveguides on the substrate before mounting the laser die, and pre-creating redistribution structures before final packaging. This preliminary preparation significantly improves integration efficiency by eliminating complex post-assembly operations
2Device complexity
If conventional mounting methods are used for integrating laser die on substrate, then device complexity is minimized, but packaging quality and performance deteriorate
Solution Approach 1:
The patent introduces redistribution structures as intermediary elements between the laser die and the substrate. These redistribution structures serve as mediators that improve signal transmission and packaging quality without significantly increasing overall device complexity, as they integrate seamlessly with the existing substrate architecture
Solution Approach 2:
The patent employs three-dimensional packaging arrangements where optical modulators, waveguides, and laser die are positioned in multiple layers and orientations. This dimensional approach improves packaging quality and performance by optimizing optical paths and electrical connections without proportionally increasing device footprint
Data Source
AI summary
Semiconductor packages are provided. The semiconductor package includes a photonic integrated circuit, an electronic integrated circuit and a high performance integrated circuit. The electronic integrated circuit is disposed aside the photonic integrated circuit and electrically connected to the photonic integrated circuit through a first redistribution structure. The high performance integrated circuit is disposed aside the electronic integrated circuit and electrically connected to the electronic integrated circuit through a second redistribution structure.