Semiconductor Package Removable Member Eliminates Draft Angle
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Solution Overview
Problem
The existing semiconductor device packaging molding process often damages substrate traces, causes electronic components to crack, and wastes substrate surface area due to the need for a draft angle during mold removal.
Innovation Solution
A semiconductor device package design featuring a substrate with a removable member that allows for encapsulant formation without contacting the substrate's lateral surface, eliminating the need for a draft angle and reducing surface waste, and includes a recess in the encapsulant edge to enhance adhesion with conductive wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mold is used to directly contact the substrate for forming the encapsulant, then the encapsulant can be formed to protect the electronic component, but the traces on the substrate may be damaged by the mold
Solution Approach 1:
A removable member is introduced as an intermediary between the mold and the substrate. The removable member is positioned on the substrate surface and allows the mold to form the encapsulant without directly contacting the substrate's lateral surface, thereby preventing trace damage while enabling complete encapsulant formation
Solution Approach 2:
The molding process is segmented into two distinct stages: first forming the encapsulant body, then removing the removable member to create a recess. This segmentation allows the encapsulant to be formed completely without requiring draft angles, and the recess is created separately to improve adhesion without compromising the substrate
2Ease of manufacture
If a draft angle is specified for removing the mold, then the mold can be removed easily, but a portion of the substrate surface is covered by the encapsulant which wastes surface area
Solution Approach 1:
The removable member serves as a mediator that enables complete encapsulant formation without requiring the mold to contact the substrate's lateral surface. This eliminates the need for draft angles, allowing the encapsulant to extend to the very edge of the substrate and maximize the usable surface area
Solution Approach 2:
Instead of designing the mold with a draft angle to facilitate removal, the patent inverts the approach by using a removable member that is removed after encapsulant formation. This allows the encapsulant to have a vertical or near-vertical wall without compromising mold removal, thereby maximizing surface area utilization
3Reliability
If the mold directly contacts the substrate for encapsulant formation, then the encapsulant can be formed completely, but the electronic component may be cracked or damaged by the disposal and removal of the mold
Solution Approach 1:
The removable member acts as a protective intermediary between the mold and the electronic component during the encapsulant formation process. It allows the mold to apply necessary pressure and heat without directly contacting and potentially damaging the electronic component, while still enabling complete encapsulant formation
Solution Approach 2:
The removable member provides beforehand cushioning by being positioned between the mold and the electronic component before the molding process begins. This cushioning effect protects the electronic component from direct mechanical contact and potential cracking during mold disposal and removal
4Strength
If a recess is added to the encapsulant edge to improve adhesion, then the adhesion with conductive wires improves, but the manufacturing process becomes more complex
Solution Approach 1:
The formation of the recess is merged with the existing removable member removal process. By combining these two functions into one step, the recess is created as a byproduct of removing the removable member, rather than requiring a separate manufacturing step. This minimizes the increase in manufacturing complexity while achieving improved adhesion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents damage to substrate traces and electronic components, conserves substrate surface area, and improves adhesion between conductive wires and encapsulants, enhancing the manufacturing process efficiency and package integrity.
Implementation Method 1
lowering a temperature of the removable member
Data Source
AI summary
A semiconductor device package includes a substrate, a first electronic component and a first encapsulant. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface of the substrate. The first encapsulant is disposed on the first surface of the substrate and covers the first electronic component. The first encapsulant has a first surface facing away the first surface of the substrate and includes a recess at an edge of the first surface of the first encapsulant.