Metal-Base Semiconductor Package Layout for Resin Adhesion

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Solution Overview

Problem

The adhesion between a metal base and a resin sealing portion in semiconductor devices is weak due to differences in linear expansion coefficients, leading to potential peeling of the resin, and existing methods to improve adhesion, such as surface roughening or selective plating, compromise the flexibility and design freedom of semiconductor chip mounting.

Innovation Solution

Incorporating a second conductive member made of sintered metal or metal powder-containing resin on the base, separated from the first conductive member and semiconductor components, enhances adhesion by providing additional contact points and structural support for the resin sealing portion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the surface of the metal base is roughened or selective plating is applied to improve adhesion, then the adhesion between base and resin sealing portion is improved, but the flexibility and design freedom of semiconductor chip mounting is compromised

Engineering Contradiction:

Improveadhesion between base and resin sealing portionVSAvoidflexibility in semiconductor chip mounting

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The base surface is divided into multiple regions: a first conductive member region for mounting semiconductor chips, a second conductive member region without components, and a resin sealing portion region. This segmentation allows the resin to adhere to multiple separate conductive members rather than requiring surface modification of the entire base, thus maintaining mounting flexibility while improving adhesion reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the base are assigned different functions and properties: the first conductive member region is optimized for component mounting, while the second conductive member region is specifically designed to enhance resin adhesion without interfering with chip placement. This localized functional differentiation resolves the contradiction by improving adhesion only where needed without compromising overall design freedom.

Inventive Principle:

Principle #3Local quality

2Reliability

If surface roughening or selective plating is applied to improve adhesion, then the resin sealing portion adheres better to the base, but additional manufacturing steps are required

Engineering Contradiction:

Improveadhesion between base and resin sealing portionVSAvoidnumber of manufacturing steps

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The formation of the first and second conductive members is combined into a single manufacturing process step. Both conductive members are formed simultaneously on the base using the same deposition or sintering process, eliminating the need for separate surface roughening or selective plating steps. This merging approach improves adhesion while maintaining manufacturing simplicity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The second conductive member serves multiple functions: it provides an additional adhesion interface for the resin sealing portion, acts as an electrical connection path, and serves as a structural support element. This multi-functionality allows a single structure to address adhesion concerns without requiring additional dedicated manufacturing steps.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Volume of moving object

If the second conductive member is placed close to the first conductive member, then the structure is more compact, but the risk of electrical interference or short circuit increases

Engineering Contradiction:

Improveoverall device sizeVSAvoidelectrical isolation between conductive members

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The resin sealing portion acts as an intermediary material between the first and second conductive members. It provides both mechanical support and electrical insulation, allowing the conductive members to be positioned close together for compactness while maintaining reliable electrical isolation. The resin's dielectric properties enable this close proximity without short circuit risk.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves the adhesion between the base and resin sealing portion, preventing peeling while maintaining flexibility in semiconductor chip arrangement and reducing the number of manufacturing steps.

Implementation Method 1

a second conductive member that is provided on the base and contains a sintered metal or metal powder-containing resin

Methodology Applied

Scientific EffectSintering: Sintering

Data Source

PatentUS20250364390A1Semiconductor device and method of manufacturing same

Publication Date: 2025.11.27 SUMITOMO ELECTRIC DEVICE INNOVATIONS

AI summary

A semiconductor device includes a base having an upper surface, at least the upper surface being made of metal; one or more components that are mounted on the base with a first conductive member interposed between the one or more components and the base and includes a semiconductor chip; a second conductive member that is provided on the base and contains a sintered metal or a metal powder-containing resin and on which the one or more components are not mounted; a resin sealing portion that is provided over the base in contact with the base, the one or more components, and the second conductive member to seal the one or more components. The second conductive member is separated from the first conductive member.