Semiconductor Package Resin Barrier for Solder Ball Protection

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Solution Overview

Problem

In semiconductor packages, the physical properties difference between resin and solder balls can cause damage to the solder balls, leading to malfunction of electronic components, necessitating a structure that keeps them spaced apart.

Innovation Solution

A semiconductor package design with a printed circuit board featuring solder balls on its surface, an electronic component mounted on some of the balls, resin filling the space between the board and component, and a blocking structure on the board to separate the solder balls from the resin, preventing contact and potential damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If resin is disposed to fill the space between the electronic component and the printed circuit board, then the electronic component is protected, but the solder ball may be damaged due to contact with the resin

Engineering Contradiction:

Improveprotection of electronic componentVSAvoiddamage to solder ball

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a blocking structure that segments the space between the electronic component and printed circuit board, creating distinct regions: one where resin can fill for protection, and another where solder balls are isolated from resin contact. This segmentation resolves the contradiction by allowing resin to provide protection while preventing it from damaging the solder balls through physical separation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The blocking structure acts as an intermediary element between the resin and the solder ball. It allows the resin to fulfill its protective function in the available space while simultaneously preventing harmful contact with the solder ball, thus mediating between the protective need and the damage prevention requirement.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If a blocking structure is introduced to separate solder balls from resin, then solder ball integrity is maintained, but the device structure becomes more complex

Engineering Contradiction:

Improveintegrity of solder ballVSAvoidstructure of semiconductor package

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The blocking structure is merged with the printed circuit board as an integrated feature rather than a separate component. By forming the blocking structure as part of the board structure itself (through protrusions or patterns on the board), the patent reduces overall device complexity while still achieving the necessary separation function.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS20250096186A1Semiconductor package including resin, and electronic device including same

Publication Date: 2025.03.20 SAMSUNG ELECTRONICS CO LTD

AI summary

An electronic device may be provided and include: a printed circuit board includes a first side and a second side perpendicular to the first side; a plurality of solder balls on a surface of the printed circuit board and spaced apart from the first side and the second side; an electronic component including at least one circuit, the electronic component on at least some of the plurality of solder balls; a resin along the first side and filling a portion of a space between the surface of the printed circuit board and the electronic component; and a blocking structure in or on the surface of the printed circuit board, the blocking structure being between the plurality of solder balls and the first side, and extending along the first side such as to separate the at least some of the plurality of solder balls from the resin.