Semiconductor Package Resin Recess for Stress Relief and Heat Dissipation
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Solution Overview
Problem
Surface mount packages face challenges in reducing stress applied to semiconductor elements during packaging, leading to variations in electrical characteristics, and fully-molded type semiconductor devices have insufficient heat radiation performance.
Innovation Solution
A semiconductor device with a recessed portion in the encapsulating resin above the element region sensitive to stress, reducing resin thickness and stress application, and a manufacturing method involving a mold with protruding portions to form this recessed area during encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a fully-molded type semiconductor device is used to reduce warpage, then stress on the semiconductor element is reduced, but heat radiation performance deteriorates
Solution Approach 1:
The patent applies local quality by creating a recessed portion in the encapsulating resin specifically above the element region with high stress sensitivity. This localized modification reduces resin thickness only where needed to minimize stress on the semiconductor element, while maintaining adequate resin thickness in other areas for proper encapsulation and heat radiation.
2Stress or pressure
If resin thickness above the element region is reduced to reduce stress, then stress on the semiconductor element is reduced, but encapsulation protection is compromised
Solution Approach 1:
The recessed portion is strategically positioned above the element region with high stress sensitivity, creating localized stress relief while preserving adequate resin thickness in surrounding areas. This ensures the semiconductor element is protected from excessive stress during mounting while maintaining sufficient encapsulation protection overall.
Solution Approach 2:
The encapsulating resin is effectively segmented into regions of different thicknesses - a thinner region above the stress-sensitive element area and thicker regions elsewhere. This segmentation allows differential protection, providing stress relief where needed while maintaining protective encapsulation in other areas.
Data Source
AI summary
A semiconductor element is mounted on a die pad, and electrode pads arranged at an outer circumference of a surface of the semiconductor element are electrically connected to leads by wires, respectively. The semiconductor element, the die pad, and the leads are covered with an encapsulating resin. The semiconductor element has an element region having a high sensitivity with respect to stress, and an element region having a relatively low sensitivity with respect to stress. A recessed portion is formed in a surface of the encapsulating resin at a position above the element region having a high sensitivity with respect to stress.