Semiconductor Package Resin Substrate Shielding
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Solution Overview
Problem
In downsized semiconductor device housing packages, the increased number of lead terminals leads to narrowed spacing, posing a risk of electrical short-circuiting and electromagnetic leakage of input-output signals.
Innovation Solution
The use of a resin substrate with flexible second wiring conductors and a metallic film configuration that surrounds the first wiring conductors, along with a joining member to disperse elastic deformation forces and minimize electromagnetic leakage, reduces the risk of short-circuiting and enhances joinability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of lead terminals is increased to accommodate more input-output connections, then the functionality and versatility of the package is improved, but the spacing between adjacent lead terminals is narrowed which increases the risk of electrical short-circuiting
Solution Approach 1:
A resin substrate is introduced as an intermediary component between the lead terminals. This resin substrate provides mechanical support and electrical insulation, maintaining adequate spacing between adjacent lead terminals even when the number of terminals is increased. The resin substrate acts as a mediator that prevents direct contact between terminals while allowing them to be densely packed for enhanced functionality.
2Volume of moving object
If the package is downsized to reduce overall dimensions, then the compactness and integration are improved, but the spacing between lead terminals is reduced which may cause electrical short-circuiting
Solution Approach 1:
The resin substrate functions as a flexible insulating film that can be precisely controlled in thickness and dimensions. This thin film structure allows the package to be downsized while maintaining adequate electrical insulation and mechanical spacing between lead terminals. The flexible nature of the resin substrate enables it to adapt to compact packaging requirements without compromising terminal spacing.
3Area of stationary object
If the lead terminals are placed closer together to reduce package area, then the area utilization is improved, but electromagnetic leakage of input-output signals increases
Solution Approach 1:
The resin substrate serves as an electromagnetic shielding intermediary between closely spaced lead terminals. By positioning the resin substrate between adjacent terminals, it provides electrical insulation and reduces electromagnetic coupling between neighboring signal lines. This mediator approach allows terminals to be placed closer together for better area utilization while minimizing electromagnetic interference and signal leakage.
Data Source
Figure 1
Figure 2
Figure 3(a)~3(b)
AI summary
A semiconductor device housing package(1) includes a base body (5) having, on its upper surface, a mounting region for placement of a semiconductor device (3); a frame body (7) having a frame-like portion disposed on the upper surface of the base body (5) so as to surround the mounting region, and an opening penetrating through from an inner side of the frame-like portion to an outer side thereof; a flat plate-like insulating member (9) disposed in the opening so as to extend from an interior of the frame body (7) to an exterior thereof; wiring conductors (11) disposed on an upper surface of the insulating member (9) so as to extend from the interior of the frame body (7) to the exterior thereof; and a continuous metallic film (35) disposed on a part of the upper surface of the insulating member (9), the metallic film (35) lying outside the frame body (7) so as to surround the wiring conductors (11).