Semiconductor Package Resin Layout for Low-Warpage Interconnects
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Solution Overview
Problem
Semiconductor packages face challenges in achieving high reliability and yield due to warpage issues caused by uneven resin layer thicknesses, which affect the interconnectivity and stability of the package.
Innovation Solution
A semiconductor package design with a redistribution member, interconnect chip, via structure, and encapsulant, where the thickness of the resin layers above and below the interconnect chip are controlled to be at a similar level, and bump structures with a triple-layer structure are formed to reduce warpage and enhance connectivity, including first and second bump structures with different shapes to accommodate the reduced encapsulant thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the resin layer thickness is increased to ensure adequate encapsulation, then the encapsulation coverage is improved, but the warpage of the substrate increases
Solution Approach 1:
The patent applies local quality by creating different resin layer thicknesses in different regions: a first resin layer with greater thickness above the via structure provides adequate encapsulation coverage, while a second resin layer with lesser thickness above the interconnect chip minimizes warpage. This spatial variation in thickness resolves the contradiction between sufficient encapsulation and substrate stability.
2Device complexity
If the bump structure is simplified to reduce manufacturing complexity, then the device complexity is reduced, but the connectivity reliability deteriorates
Solution Approach 1:
The patent employs composite materials by constructing the bump structure with multiple material layers: a conductive layer providing electrical connectivity, an intermediate layer for adhesion and stress management, and a protective layer for mechanical strength and environmental protection. This multi-material approach ensures connectivity reliability while maintaining reasonable manufacturing complexity through established layering techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The controlled resin layer thickness and triple-layer bump structures significantly reduce warpage, improving the reliability and yield of the semiconductor package by ensuring consistent interconnectivity and stability.
Implementation Method 1
a first plating layer disposed on the first foil layer
Implementation Method 2
an encapsulant encapsulating at least a portion of each of the interconnect chip and the via structure
Data Source
AI summary
A semiconductor package includes: a substrate including a redistribution member having a first surface and a second surface, opposing each other, and including pad structures disposed on the first surface and a redistribution layer electrically connected to the pad structures, an interconnect chip disposed on the second surface of the redistribution member and including an interconnect circuit electrically connected to the redistribution layer, a via structure disposed around the interconnect chip and electrically connected to the redistribution layer, an encapsulant encapsulating at least a portion of each of the interconnect chip and the via structure, and bump structures disposed on the encapsulant; and a first chip structure and a second chip structure disposed on the first surface of the redistribution member and electrically connected to the pad structures.