Semiconductor Package Rim Substrate Through Hole Design
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Solution Overview
Problem
Conventional wafer level packages are large due to the need to space metal solder away from semiconductor element electrodes, making them inconvenient.
Innovation Solution
A semiconductor package design featuring an element substrate with a functional element and extracting electrode, surrounded by a rim substrate with a conductor-filled through hole for sealing and electrical connection, and a cover substrate with a takeout electrode, allowing for a compact and sealed configuration without direct contact between solder and electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal solder is used for the junction between substrate and wafer, then reliable electrical connection is achieved, but the package size increases due to required spacing between solder and electrode pad
Solution Approach 1:
The patent introduces an insulating film as an intermediary layer between the metal solder and the electrode pad. This mediator allows the solder to make electrical contact with the pad while preventing direct contact that would cause short circuits, thereby enabling compact packaging without sacrificing connection reliability
Solution Approach 2:
The patent transitions from planar spacing (2D separation) to vertical layering (3D arrangement) by stacking the insulating film above the electrode pad and the solder above the insulating film. This dimensional change allows electrical connection and insulation to coexist in a compact vertical structure rather than requiring lateral spacing
2Strength
If solder is applied to surround the semiconductor element for junction, then strong mechanical bonding is achieved, but the risk of solder elution or re-fusing increases
Solution Approach 1:
The insulating film acts as a protective intermediary between the solder and the electrode pad, preventing solder elution onto the pad and avoiding re-fusing issues while maintaining the mechanical bonding strength of the junction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design results in a compact semiconductor package that effectively seals the functional element while preventing solder contact with electrodes, maintaining electrical connectivity and reducing the risk of solder elution or re-fusing, thus enhancing package efficiency and reliability.
Implementation Method 1
a connecting electrode which is: formed by packing the first through hole with a first conductor material, configured to seal a signal extracting aperture of the extracting electrode, and configured to electrically connect the signal extracting aperture with a takeout electrode
Data Source
AI summary
A semiconductor package, includes: element substrate having first surface, including: functional element on first surface, and extracting electrode on first surface and configured to output a signal of functional element, extracting electrode being disposed around functional element; rim substrate shaped into a frame, and configured to have first junction with element substrate to surround functional element, rim substrate including: first through hole through rim substrate, and connecting electrode which is: formed by packing first through hole with first conductor material, configured to seal signal extracting aperture of extracting electrode, and configured to electrically connect signal extracting aperture with takeout electrode; and cover substrate configured to have second junction with rim substrate to block aperture of rim substrate, cover substrate including: second through hole through cover substrate, and takeout electrode which is: formed by packing second through hole with second conductor material, and configured to take out signal of functional element.