Semiconductor Package Substrate with Ring-Shaped Conductive Structure
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Solution Overview
Problem
The existing semiconductor packaging technology using leadframes is heavy and large, which does not align with the industry's trend of lightweight, compact, and slim electronic products, and there is a need for a method to downsize the substrate structure and semiconductor package.
Innovation Solution
A manufacturing method that involves a conductive carrier with a first and second conductive layer, where the electrical component is encapsulated in a package body that exposes the conductive structure, and a ring-shaped conductive structure is formed to surround the package, allowing for a smaller substrate structure and semiconductor package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a leadframe is used to carry the chip and seal with molding compound, then the chip is protected from moisture and damage, but the package becomes heavy and large
Solution Approach 1:
The patent extracts and removes the traditional leadframe structure from the packaging system. Instead of using a heavy leadframe, the invention uses a substrate with conductive layers and conductive posts to achieve the same electrical connection function, thereby eliminating the weight and size burden of the leadframe while maintaining chip protection through the molding compound.
Solution Approach 2:
The patent changes the material parameters and structural parameters of the packaging system. It transitions from a leadframe-based structure to a substrate-based structure with controlled conductive layers, changing the density, thickness, and material composition to achieve lightweight and compact packaging while maintaining protective functionality.
2Reliability
If a leadframe is used to carry the chip, then electrical connection is achieved, but the package size increases
Solution Approach 1:
The patent extracts the essential electrical connection function from the bulky leadframe structure and implements it through a compact substrate with conductive layers and conductive posts. This extraction allows maintaining reliable electrical connection while dramatically reducing the package area.
Solution Approach 2:
The patent transitions from a two-dimensional leadframe layout to a three-dimensional substrate structure with multiple conductive layers at different heights. The conductive posts extend vertically to provide electrical connection, utilizing the vertical dimension to reduce the horizontal footprint and overall package area.
3Volume of moving object
If the substrate structure is downsized, then compactness is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the electrical connection function into multiple independent components: conductive layers, conductive posts, and bonding pads. This segmentation allows each component to be manufactured separately using standard processes and then integrated, reducing overall manufacturing complexity while achieving compact substrate volume.
Solution Approach 2:
The substrate structure is designed to perform multiple functions simultaneously: providing mechanical support, establishing electrical connections, and enabling heat dissipation. The conductive layers and posts serve both structural and electrical purposes, reducing the need for additional components and simplifying manufacturing despite the compact design.
Data Source
AI summary
A manufacturing method of a semiconductor package includes the following steps. Firstly, a conductive carrier is provided. Then, a first conductive layer is formed on a lower surface of the conductive carrier. Then, a second conductive layer is formed on a lower surface of the first conductive layer, wherein the second conductive layer and the first conductive layer together constitute a conductive structure. Then, an electrical component is disposed on the lower surface of the first conductive layer. Then, a first package body encapsulating the first conductive layer, the second conductive layer and the electrical component but not covering an edge of the lower surface of the conductive carrier is formed. Then, a portion of the first package body is removed. Then, partial material of the conductive carrier is removed, such that a reserved part of the conductive carrier forms a ring-shaped conductive structure.