Semiconductor Package Scratch Protection Layer
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Solution Overview
Problem
Semiconductor packages with heat dissipation schemes face challenges in mechanical robustness, as dielectric heat conductor parts are prone to damage during handling due to their low mechanical strength, which can lead to scratches and increased thermal resistance.
Innovation Solution
A semiconductor package design featuring a carrier with a semiconductor die, a heat conductor part exposed through an encapsulation body of different material composition, and a scratch protection layer with hardness at least five times higher than the heat conductor part, using organic-inorganic hybrid polymers or rapid aging treatments to enhance durability without inhibiting heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat conductor part is used to transfer heat from the semiconductor die to the heatsink or PCB, then thermal resistance is reduced, but mechanical robustness deteriorates making the part prone to scratches and damage during handling
Solution Approach 1:
The patent applies composite materials by combining a heat conductor part with a scratch protection layer having different material composition. The heat conductor part maintains low thermal resistance while the scratch protection layer with at least five times higher hardness provides mechanical robustness. This composite structure resolves the contradiction by allowing each layer to perform its specialized function without compromising the other.
2Temperature
If the heat conductor part is exposed from the encapsulation body to maintain thermal contact, then heat transfer efficiency is improved, but the part becomes more vulnerable to mechanical damage during customer handling
Solution Approach 1:
The patent implements beforehand cushioning by applying a scratch protection layer to the exposed heat conductor part before the product reaches the customer. This protective layer is designed with at least five times higher hardness than the heat conductor part, creating a sacrificial protective barrier that absorbs mechanical damage during handling and transport, thereby preserving the underlying heat conductor part.
3Strength
If a scratch protection layer with high hardness is applied to the heat conductor part, then mechanical robustness is enhanced, but thermal conductivity may be compromised
Solution Approach 1:
The patent applies local quality by creating a layered structure where different regions have different properties. The scratch protection layer has high hardness for mechanical protection while the heat conductor part beneath it maintains low thermal resistance. The local quality principle allows the protective layer to be optimized for scratch resistance in the exposed area while the underlying structure maintains thermal conductivity, with the interface designed to minimize thermal barrier effects.
Data Source
AI summary
A semiconductor package includes: a carrier having a first side and an opposing second side; a semiconductor die arranged on the first side of the carrier; a heat conductor part arranged on the second side of the carrier; an encapsulation body encapsulating the semiconductor die, wherein the heat conductor part is exposed from the encapsulation body, and wherein the heat conductor part has a different material composition than the encapsulation body; and a scratch protection layer covering the heat conductor part, wherein the scratch protection layer has a hardness which is at least five times higher than a hardness of the heat conductor part.