Semiconductor Package Segmentation for Pad Density
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Solution Overview
Problem
Current semiconductor packages face limitations in accommodating a large number of input/output terminals due to the size constraints of solder balls, leading to increased costs and process complexities when integrating active and passive devices in a single package.
Innovation Solution
A semiconductor package is fabricated with a separate substrate mounting device, where the semiconductor chip is embedded in a mounting block with an interconnection part, allowing for the exposure of pads and conductive materials on the surface, and an encapsulant integrates the chip and block, enabling efficient electrical connection and reduced package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bumping process is used for electrical connection between semiconductor chips or between a semiconductor chip and a substrate, then electrical connection is achieved, but the number of input/out pads and chip size are limited due to limitations in reducing the size of the bump
Solution Approach 1:
The invention divides the packaging system into separate modules: the semiconductor chip is packaged in a first package, and the passive device is packaged in a second package. These separate packages are then connected through a substrate, avoiding the need for direct bumping between chip and passive device. This segmentation allows each component to be optimized independently, resolving the contradiction between achieving reliable electrical connection and minimizing chip size limitations.
2Adaptability or versatility
If active devices and passive devices are mounted on one package substrate at the same time, then integration is achieved, but a high-end package substrate is required which results in an increase in package prices and process difficulties
Solution Approach 1:
The invention separates active and passive devices into different packages mounted on opposite sides of a substrate. This segmentation allows the use of a simple, low-cost substrate without the complex high-end substrate requirements that would be needed if all devices were integrated on a single substrate. The segmentation resolves the contradiction by achieving functional integration while avoiding substrate complexity.
Solution Approach 2:
The substrate acts as an intermediary element that connects the first package (containing the semiconductor chip) and the second package (containing the passive device). This intermediary approach allows integration of active and passive devices without requiring them to be mounted on the same complex substrate, thereby reducing package substrate requirements and costs while maintaining integration benefits.
3Adaptability or versatility
If a pick- and placement process is used to mount passive devices together with active devices on the same substrate, then mounting is achieved, but time spent in the pick- and placement process increases which directly results in an increase in package prices
Solution Approach 1:
The invention segments the mounting process by pre-assembling passive devices on a separate second package substrate before mounting it as a single unit on the main substrate. This eliminates the need for individual pick-and-place operations for each passive device, significantly reducing process time and costs while maintaining the ability to mount multiple devices together with the active device.
Data Source
AI summary
Disclosed herein is a semiconductor package in which a semiconductor chip and a mounting device are packaged together. The semiconductor package includes a semiconductor chip, a mounting block on which a first mounting device is mounted on a substrate that includes a circuit formed thereon, and an interconnection part configured to electrically connect the semiconductor chip to the mounting block.