Semiconductor Package Self-Alignment for Fine-Pitch Chip Bonding
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Solution Overview
Problem
The challenge in semiconductor packaging is to minimize the size of semiconductor packages while ensuring reliable connection reliability, especially as electronic devices become more compact and multi-functional, requiring highly integrated semiconductor chips with increased I/O connection terminals.
Innovation Solution
A method of manufacturing semiconductor packages by self-aligning semiconductor chips on pads with fine gaps using the surface tension of solder bumps, involving the formation of sacrificial pads and solder bumps, bonding metal pillars, and forming a redistribution layer to reduce distances between chips and enhance connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packaging methods are used, then connection reliability is ensured, but the package size is large due to larger distances between chips
Solution Approach 1:
The solder bumps automatically self-align with the metal pillars through surface tension during the bonding process, eliminating the need for complex external alignment mechanisms. This self-alignment capability enables precise positioning with minimal distances between chips while maintaining reliable connections, thereby reducing overall package size without compromising connection reliability.
Solution Approach 2:
The invention changes the physical state of solder bumps from solid to liquid during bonding, utilizing surface tension in the liquid state to achieve precise self-alignment. This parameter change (phase transition) enables the solder bumps to automatically adjust and align with metal pillars, allowing for smaller pitch distances and reduced package size while ensuring reliable electrical connections.
2Volume of moving object
If the distance between chips is minimized, then package size is reduced, but alignment precision becomes more difficult to achieve
Solution Approach 1:
The solder bumps perform self-alignment with metal pillars through surface tension, automatically compensating for minor positioning variations. This self-correcting mechanism enables precise alignment even when chips are placed at minimal distances, eliminating the need for complex external alignment systems and maintaining high manufacturing precision in compact package designs.
Solution Approach 2:
The solder bumps act as an intermediary element between chips and the substrate, providing a self-aligning bonding interface. The surface tension of the molten solder serves as a mediating force that automatically positions the chips accurately relative to the metal pillars, enabling precise alignment in miniaturized packages without requiring advanced external alignment equipment.
3Adaptability or versatility
If the number of connection terminals is increased, then I/O capacity is improved, but device complexity increases
Solution Approach 1:
The self-aligning solder bump technology automatically handles the complexity of positioning multiple connection terminals, reducing the need for complex external alignment and positioning systems. This enables the implementation of high-density I/O configurations with increased connection terminals while keeping the manufacturing process and device structure relatively simple.
Solution Approach 2:
The invention replaces complex mechanical alignment systems with a materials-based self-alignment mechanism using surface tension of solder bumps. This substitution eliminates the need for complex mechanical positioning equipment and procedures, enabling high I/O capacity with reduced device complexity in both manufacturing and structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the size of semiconductor packages by minimizing chip distances and ensuring reliable connections through self-alignment, thereby addressing the need for compact and highly integrated semiconductor solutions.
Implementation Method 1
by self-aligning the semiconductor chips on pads having fine gaps due to the surface tension of solder bumps
Data Source
AI summary
A method of manufacturing a semiconductor package according to embodiments of the present disclosure has an effect of reducing the size of the semiconductor package by minimizing a distance between semiconductor chips by self-aligning the semiconductor chips on pads having fine gaps due to the surface tension of solder bumps.