Semiconductor Package Self-Alignment for Precise Chip Placement
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Solution Overview
Problem
Current fan-out packaging methods lack efficient and economical high-precision placement and position fixation of chips, relying on expensive equipment with high costs, slow speeds, and low positioning accuracy.
Innovation Solution
A semiconductor packaging method involving a semiconductor device with an active surface and a passive surface, where the active surface has connecting terminals and a first molding layer, and the passive surface has alignment bonding parts. A carrier with corresponding alignment bonding parts is used, and alignment solder bumps and pads are employed for fusion bonding, allowing for self-alignment and precise fixation of the semiconductor device on the carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If expensive placement machines are used for chip placement, then positioning accuracy is improved, but equipment cost increases and placement speed decreases
Solution Approach 1:
The patent implements self-alignment through alignment solder bumps and alignment pads that automatically position the semiconductor device on the carrier during the bonding process. The alignment features guide the device into precise registration without requiring external placement machinery, enabling the system to self-correct positioning errors and achieve high precision through the inherent properties of the alignment structures rather than expensive equipment
Solution Approach 2:
The patent replaces the mechanical placement machine system with a fusion bonding system using alignment solder bumps and pads. Instead of relying on mechanical positioning mechanisms, the invention uses metallurgical bonding processes where the alignment features are formed through material deposition and bonding, substituting complex mechanical positioning with simpler material-based alignment and fixation
2Manufacturing precision
If expensive placement machines are used for chip placement, then positioning accuracy is improved, but placement speed decreases
Solution Approach 1:
The self-alignment mechanism allows rapid positioning by eliminating the need for slow, precision mechanical placement operations. The alignment solder bumps and pads automatically guide the device into position during bonding, enabling fast processing speeds while maintaining high accuracy through the inherent self-correcting nature of the alignment features
Solution Approach 2:
The patent changes the fundamental parameter of positioning from mechanical control to material-based bonding control. By using fusion bonding of alignment features rather than mechanical placement, the process achieves both high speed and high precision simultaneously, as the bonding process inherently provides both rapid fixation and accurate positioning in a single operation
3Manufacturing precision
If alignment solder bumps and pads are used for fusion bonding, then positioning accuracy is improved and equipment cost is reduced, but process complexity increases
Solution Approach 1:
The patent divides the bonding interface into distinct functional elements: alignment solder bumps on one component and corresponding alignment pads on the other. This segmentation of the bonding interface into specialized alignment features separates the alignment function from the general bonding function, making each feature simpler and more reliable while collectively achieving high positioning accuracy
Solution Approach 2:
The alignment solder bumps and pads serve multiple functions simultaneously: they provide mechanical alignment guidance, establish electrical connections, and create the bonding interface for fixation. This multi-functionality consolidates several operations into a single integrated feature set, reducing overall process complexity despite the added precision capabilities
4Productivity
If alignment solder bumps and pads are used for fusion bonding, then placement precision requirement is reduced and process efficiency is improved, but manufacturing steps increase
Solution Approach 1:
The alignment solder bumps and pads are formed in advance on the carrier and semiconductor device before the actual bonding operation. This preliminary formation of alignment features allows the main bonding process to proceed rapidly without requiring complex real-time positioning adjustments, improving overall process efficiency despite the additional preliminary manufacturing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables accurate alignment and fixation of semiconductor devices, reduces the requirement for precise placement, improves process efficiency and reduces costs, while also enhancing the chemical resistance and protection reliability of the semiconductor device.
Implementation Method 1
The alignment solder bumps and the alignment pads are substantially aligned, and fusion bonding is carried out on the alignment solder bumps and the alignment pads
Data Source
AI summary
The semiconductor packaging method forms a semiconductor assembly including a semiconductor device by automatically pulling the semiconductor device to a target position on a carrier using the surface tension generated by alignment solder bumps in a molten state through fusion bonding of first alignment bonding parts on the semiconductor device and second alignment bonding parts on the carrier. The method allows a certain degree of placement deviation when the semiconductor device is picked and placed on the carrier, and accurately fixes the semiconductor device at the target position after the alignment bonding solder bumps are solidified. Thus, drifting and rotation of the semiconductor device in a molding process are prevented. In addition, the active surface and the connecting terminals of the semiconductor device are pre- sealed to avoid height restriction of the connecting terminals, improve the chemical resistance of the connecting terminals, and protect the reliability of the active surface.