Semiconductor Package Self-Alignment for Bridge-Connected Dies
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Solution Overview
Problem
Existing semiconductor packaging technologies face challenges in achieving precise alignment and reliable electrical connections between multiple semiconductor dies, which affects data transmission speed and the reliability of packaged products.
Innovation Solution
The manufacturing process involves forming self-aligned structures on the rear surfaces of semiconductor dies by soldering alloy layers, which corrects initial placement shifts and improves alignment with bridge structures, thereby enhancing electrical connections and package reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional semiconductor packaging methods are used, then manufacturing process is simple, but alignment precision between dies and bridge structures is poor
Solution Approach 1:
The patent applies preliminary action by forming self-aligned structures on the rear surfaces of semiconductor dies before the final packaging assembly. These structures are created in advance to compensate for and correct placement shifts that occur during the die attachment process, ensuring precise alignment with bridge structures without requiring complex real-time adjustment mechanisms.
Solution Approach 2:
The self-aligned structures enable the semiconductor dies to self-correct their positioning. When dies are placed on the carrier, any placement shifts are automatically compensated by the self-aligned structures, which guide the dies into proper alignment with the bridge structures without requiring external intervention or complex alignment systems.
2Manufacturing precision
If precise alignment is achieved through complex positioning systems, then alignment precision improves, but manufacturing cost and process complexity increase
Solution Approach 1:
The packaging structure uses self-aligned structures that automatically correct placement shifts without requiring complex positioning systems. The self-aligned structures on the die rear surfaces work with corresponding structures on the bridge to provide self-correcting alignment, simplifying the manufacturing process while maintaining high placement accuracy.
Solution Approach 2:
The self-aligned structures act as intermediary elements between the semiconductor dies and the bridge structures. These intermediary structures facilitate precise alignment by providing a mechanical interface that compensates for placement variations, enabling accurate positioning without complex direct positioning systems.
3Speed
If multiple dies are connected with bridge structures, then data transmission speed improves, but reliability of electrical connections decreases due to placement shifts
Solution Approach 1:
The self-aligned structures provide a feedback mechanism that detects and corrects placement shifts. When dies are placed on the carrier, any deviations from the intended position are compensated by the self-aligned structures, which adjust the alignment between the die connection pads and the bridge contact pads, ensuring reliable electrical connections despite initial placement variations.
Solution Approach 2:
The patent applies beforehand cushioning by incorporating self-aligned structures that anticipate and compensate for potential placement shifts. These structures are designed in advance to accommodate a range of placement variations, providing a buffer that ensures reliable electrical connections even when dies are not positioned with perfect accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The self-aligned structure effectively corrects placement shifts, improves alignment with bridge structures, and enhances the reliability of electrical connections, leading to improved data transmission speed and reduced failure rates in semiconductor packages.
Implementation Method 1
forming self-aligned structures on the rear surfaces of semiconductor dies by soldering alloy layers
Data Source
AI summary
A semiconductor package includes semiconductor bridge, first and second multilayered structures, first encapsulant, and a pair of semiconductor dies. Semiconductor dies of the pair include semiconductor substrate and conductive pads disposed at front surface of semiconductor substrate. Semiconductor bridge electrically interconnects the pair of semiconductor dies. First multilayered structure is disposed on rear surface of one semiconductor die. Second multilayered structure is disposed on rear surface of the other semiconductor die. First encapsulant laterally wraps first multilayered structure, second multilayered structure and the pair of semiconductor dies. Each one of first multilayered structure and second multilayered structure includes a top metal layer, a bottom metal layer, and an intermetallic layer. Each one of first multilayered structure and second multilayered structure has surface coplanar with surface of first encapsulant. The top metal layers, the bottom metal layers, and the intermetallic layers are in contact with the first encapsulant.