Semiconductor Package Substrate Cavity for Sensor Noise Reduction
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Solution Overview
Problem
Conventional semiconductor packages with detecting functions face challenges due to large chip volumes, leading to increased noise and limited functionality, which hampers their ability to meet multiple function requirements and reduces product competitiveness.
Innovation Solution
A semiconductor package design featuring a substrate with a light or thermal sensor, a support, a cover, and a plate, where the second surface of the substrate has an opening to form a second space between the plate and the sensor, reducing the substrate's volume and enhancing detecting capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the chip volume is increased to accommodate detecting functions, then the detecting capability is improved, but the noise increases and the package size becomes larger
Solution Approach 1:
The patent divides the substrate into multiple functional regions: a first region housing the detecting element and a second region forming a cavity. This segmentation allows the detecting element to be isolated in a dedicated space, reducing noise interference from other components while maintaining detecting capability.
Solution Approach 2:
The patent introduces a cavity structure as an intermediary space between the detecting element and the external environment. This cavity acts as a noise-isolating chamber that protects the detecting element from external interference while allowing the detecting function to operate effectively.
2Measurement precision
If the chip volume is increased to accommodate detecting functions, then the detecting capability is improved, but the package layout space is consumed
Solution Approach 1:
The patent utilizes vertical dimension by creating a cavity structure that extends downward from the substrate surface. This three-dimensional approach allows the detecting element to have enhanced capability without proportionally increasing the planar layout area, as the additional space is achieved in the vertical direction rather than horizontal expansion.
3Object-affected harmful factors
If the substrate volume is reduced to decrease noise, then the noise is decreased, but the detecting capability may be compromised
Solution Approach 1:
The substrate is segmented into a first region for the detecting element and a second region for the cavity. This segmentation allows the detecting element to maintain its required volume and capability while the overall substrate volume is effectively reduced through the cavity structure that eliminates unnecessary material and isolates noise.
4Adaptability or versatility
If multiple functions are integrated into semiconductor packages, then the product competitiveness is improved, but the device complexity increases
Solution Approach 1:
The patent designs a universal package structure with a standardized substrate and cavity configuration that can accommodate different detecting elements and support multiple functions. This multi-functional design allows the same basic structure to be applied across various applications, reducing the need for completely different package designs for each function.
Data Source
AI summary
A semiconductor package includes a substrate, at least one support, a cover, and a plate. The substrate has at least one light sensor or thermal sensor, a first surface, and a second surface opposite to the first surface. The light sensor or the thermal sensor is disposed on the first surface. The second surface has an opening to expose the light sensor (or the thermal sensor). The support is disposed on the first surface. The cover is disposed on the support, such that the cover is above the light sensor (or the thermal sensor) to form a first space between the cover and the light sensor (or the thermal sensor). The plate is placed on the second surface to cover the opening, such that a second space is formed between the plate and the light sensor (or the thermal sensor).