Semiconductor Package Temperature Sensor Thermal Isolation
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Solution Overview
Problem
Semiconductor packages face challenges in effectively dissipating heat and monitoring temperature in high-temperature environments without requiring separate remote temperature sensors or optical temperature sensors, as existing solutions do not adequately isolate the semiconductor die from temperature sensing leads while maintaining electrical connectivity.
Innovation Solution
Incorporating a temperature sensor mounted proximate temperature sensing leads, with the semiconductor die electrically connected but physically separated by mold compound, which acts as a thermal barrier, allowing for direct thermal coupling with heat sources and electrical connection to external components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the semiconductor die is placed in direct contact with temperature sensing leads, then temperature sensing accuracy is improved, but the semiconductor die is exposed to high-temperature environments which reduces reliability
Solution Approach 1:
The patent divides the package into distinct thermal zones: a first region containing the semiconductor die and a second region containing the temperature sensor and temperature sensing leads. The mold compound physically separates these regions, allowing the temperature sensor to be positioned close to heat-generating components for accurate measurement while keeping the semiconductor die isolated from high-temperature exposure.
2Reliability
If a remote temperature sensor is used to separate the semiconductor die from high-temperature environments, then semiconductor die reliability is improved, but device complexity increases
Solution Approach 1:
The patent integrates the temperature sensor directly into the leadframe structure, specifically mounting it on a die pad within the leadframe. This merging of the temperature sensing function into the existing leadframe architecture allows for accurate temperature monitoring and effective thermal management without adding separate remote sensor components or increasing overall device complexity.
3Measurement precision
If the temperature sensor is mounted proximate to heat-generating components, then temperature sensing accuracy is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent creates different local thermal environments within the package: the temperature sensor region is positioned close to heat-generating components for accurate sensing, while the semiconductor die region maintains thermal management pathways for effective heat dissipation. The mold compound and leadframe structure are configured to provide localized thermal characteristics appropriate for each component's function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective temperature sensing and heat dissipation in high-temperature environments without the need for separate remote or optical sensors, ensuring reliable operation and reduced complexity in semiconductor package design.
Implementation Method 1
mold compound, which functions as a thermal barrier
Implementation Method 2
temperature sensor mounted proximate temperature sensing leads designed to be in direct contact with a component for temperature sensing
Data Source
AI summary
A semiconductor package includes a first set of leads, a temperature sensor proximate the first set of leads, a second set of leads, a semiconductor die, a first electrical connection between the temperature sensor and the semiconductor die, a second electrical connection between the semiconductor die and the second set of leads, and mold compound at least partially covering the temperature sensor, the semiconductor die, the first set of leads and the second set of leads. The mold compound physically separates the semiconductor die from the temperature sensor and the first set of leads.