Semiconductor Package Temperature Sensing With Two Shared Pins
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Solution Overview
Problem
Existing semiconductor arrangements with multiple semiconductor bodies in a common housing face challenges in efficiently and precisely detecting overload conditions without the need for multiple monitoring pins or indirect, less precise temperature measurement.
Innovation Solution
Integrate temperature sensors between a first and second pin of the housing, connecting them in parallel across each semiconductor body, using diodes or similar elements with a super linear current-temperature dependency to accurately monitor temperature and detect overload conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is placed in each semiconductor body with individual monitoring pins, then temperature monitoring precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
Multiple temperature sensors are connected in parallel between two common pins (pin 1 and pin 2), merging their electrical connections. This allows all sensors to share the same two pins for both excitation current injection and voltage measurement, eliminating the need for individual monitoring pins for each sensor while maintaining the ability to detect temperature in each semiconductor body.
Solution Approach 2:
The two common pins serve multiple functions: they provide excitation current to all temperature sensors in parallel, they collect voltage signals from all sensors, and they enable both individual and collective temperature monitoring. This multi-functionality reduces the pin count requirement while maintaining comprehensive monitoring capability.
2Reliability
If temperature sensors are integrated in each semiconductor body, then overload detection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The parallel connection of temperature sensors between two common pins merges the monitoring function across all semiconductor bodies. This approach maintains high reliability by directly monitoring each body's temperature through its integrated sensor, while reducing manufacturing cost by minimizing the number of external connections and simplifying the housing design.
3Device complexity
If indirect temperature measurement is used through temperature sensors in other semiconductor bodies, then device complexity is reduced, but measurement precision deteriorates
Solution Approach 1:
By connecting all temperature sensors in parallel between two common pins, the system merges the advantages of direct measurement (each sensor measures its own semiconductor body's temperature) with simplified wiring (all sensors share common connections). This eliminates the need for indirect measurement while reducing wiring complexity compared to fully independent connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise overload detection with a low pin count, reducing the likelihood of false alarms by accurately identifying the highest temperature among the semiconductor bodies, thus enhancing reliability and efficiency.
Implementation Method 1
using diodes or similar elements with a super linear current-temperature dependency to accurately monitor temperature
Data Source
AI summary
A semiconductor arrangement and a method for operating a semiconductor arrangement are disclosed. The semiconductor arrangement includes: a plurality of semiconductor bodies; a housing in which the plurality of semiconductor bodies are arranged; and a sensor circuit including a plurality of temperature sensors. At least one of the temperature sensors is integrated in each of the semiconductor bodies. Each of the temperature sensors is connected between a first pin and a second pin of the housing.