3D Semiconductor Package EMI Shield Grounding

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Solution Overview

Problem

The increasing complexity and demand for miniaturization in electronic components pose challenges to the reliability and stability of wafer level packaging (WLP) technologies, particularly in managing electromagnetic interference (EMI) and ensuring the integrity of stacked semiconductor dies.

Innovation Solution

A 3D semiconductor package is developed with a conductive structure between stacked dies, including an active redistribution layer (RDL) for electrical communication and a dummy RDL for non-communication purposes, surrounded by insulative material, and equipped with an EMI shield configured as a shell connected to a conductive feature for grounding, enhancing protection against external EMI.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If wafer level packaging technology is used for miniaturization, then the size of electronic components is reduced, but electromagnetic interference and reliability issues increase

Engineering Contradiction:

Improvesize of electronic componentsVSAvoidreliability and stability of packaged devices

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

An EMI shield is introduced as an intermediary component between the semiconductor die and the external environment. The shield acts as a mediator that blocks electromagnetic interference from reaching sensitive internal structures, thereby resolving the reliability issue caused by miniaturization without sacrificing the compact size advantage of WLP technology.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The EMI shield is designed to preemptively counteract electromagnetic interference before it can affect the semiconductor die. By placing the shield around the die and conductive structures, the patent creates a protective barrier that neutralizes EMI threats in advance, preventing reliability issues before they occur.

Inventive Principle:

Principle #9Preliminary anti-action

2Adaptability or versatility

If more conductive structures are added for electrical communication, then functionality increases, but electromagnetic interference susceptibility increases

Engineering Contradiction:

Improveelectrical communication capabilityVSAvoidelectromagnetic interference susceptibility

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The EMI shield provides localized protection specifically around the conductive structures and semiconductor die where electrical communication occurs. Rather than shielding the entire package uniformly, the shield is strategically positioned to protect only the areas most susceptible to EMI while maintaining electrical functionality, thus resolving the contradiction between communication capability and EMI susceptibility.

Inventive Principle:

Principle #3Local quality

3Object-affected harmful factors

If grounding structures are added for EMI protection, then EMI resistance improves, but device complexity increases

Engineering Contradiction:

ImproveEMI resistanceVSAvoidstructure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The EMI shield is merged with the existing packaging structure and grounding system. The shield is electrically connected to the substrate grounding, combining the EMI protection function with the existing structural framework. This integration approach provides effective EMI resistance while minimizing the increase in device complexity by reusing existing structural elements.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves the reliability and stability of the 3D semiconductor package by effectively managing EMI, ensuring the integrity of semiconductor dies, and enhancing the package's structural integrity through the use of insulative materials and a conductive feature for grounding, thereby addressing the challenges of miniaturization and complexity in WLP technologies.

Implementation Method 1

The shield is in contact with the conductive feature such that the shield is electrically connected to a ground terminal through the conductive feature

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11211339B2Semiconductor device

Publication Date: 2021.12.28 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor device includes a semiconductor die having an insulative layer and a conductive feature in the insulative layer, and a shield in contact with a lateral surface of the conductive feature. In some embodiments, the lateral surface of the conductive feature is aligned with an edge of the insulating material.