Semiconductor Package Shield Structure With Sealed EMI Through-Holes
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Solution Overview
Problem
Increasing integration density and demand for expanded functionality in semiconductor devices necessitate improved shielding against electromagnetic interference (EMI) to prevent performance degradation.
Innovation Solution
A semiconductor package design incorporating an electromagnetic shield structure with a cup-like configuration, featuring a side cover and an upper cover with through holes, and a sealing member to protect and seal the semiconductor chip and shield structure, utilizing materials like metal, magnetic materials, and polymers to absorb and reflect electromagnetic energy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electromagnetic shield structure is added to protect against EMI, then shielding effectiveness is improved, but device complexity increases
Solution Approach 1:
The electromagnetic shield structure is integrated within the package substrate, with the cup-like shield nested around the semiconductor chip and connected to ground pads. The sealant material fills the space between the shield and chip, creating a nested configuration that provides shielding without adding external complexity to the device architecture.
Solution Approach 2:
The electromagnetic shield utilizes a cup-like structure with controlled thickness (200-1000 μm) that acts as a flexible shielding barrier. The structure includes through-holes that allow flexibility in design while maintaining shielding effectiveness, balancing structural simplicity with protective function.
2Object-affected harmful factors
If the shield structure is made thicker to improve shielding, then shielding effectiveness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies a thickness range of 200-1000 μm for the electromagnetic shield, providing design flexibility. The through-hole dimensions are also parameterized with specific relationships to filler particle sizes, allowing manufacturers to adjust parameters within defined ranges to achieve effective shielding without requiring ultra-precise thickness control.
Solution Approach 2:
The shield structure incorporates through-holes that are filled with sealant material containing filler particles. This porous approach allows the shield to maintain effectiveness while accommodating manufacturing variations, as the fill material compensates for the holes and provides additional sealing and shielding functionality.
3Reliability
If through-holes are added to the shield for sealing purposes, then sealing effectiveness is improved, but shielding effectiveness deteriorates
Solution Approach 1:
A sealant material is introduced as an intermediary substance that fills the through-holes in the electromagnetic shield. This sealant contains filler particles and provides both sealing functionality to protect the chip and maintains shielding effectiveness by filling the conductive path gaps. The sealant acts as a mediator that reconciles the conflicting requirements of sealing and shielding.
Solution Approach 2:
The solution employs composite materials where the sealant material combines organic binder with inorganic filler particles. This composite structure provides both the sealing properties needed for reliability and the conductive/EMF-blocking properties needed for shielding, allowing the through-holes to serve dual purposes rather than compromising one function for the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively shields electromagnetic interference, maintaining device performance by preventing interference from external and internal sources while protecting the semiconductor chip from mechanical shock and contamination.
Implementation Method 1
utilizing materials like metal, magnetic materials, and polymers to absorb and reflect electromagnetic energy
Implementation Method 2
utilizing materials like metal, magnetic materials, and polymers to absorb and reflect electromagnetic energy
Implementation Method 3
a sealing member between the semiconductor chip and the electromagnetic shield structure, wherein the side cover includes first through holes and the sealing member fills the first through holes
Data Source
AI summary
A semiconductor package includes; a package substrate, a semiconductor chip on the package substrate, an electromagnetic shield structure on the package substrate and including an upper cover covering an upper surface of the semiconductor chip and a side cover surrounding the semiconductor chip, and a sealing member contacting the semiconductor chip and the electromagnetic shield structure, wherein the side cover includes first through holes and the upper cover includes second through holes.