Semiconductor Package Shielding via Electrostatic Coupling
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Solution Overview
Problem
Existing semiconductor packages face challenges in maintaining effective electromagnetic shielding against external electromagnetic waves in the frequency range of several hundred MHz to several GHz, as the shielding capabilities degrade at higher frequencies due to the influence of electric fields, and miniaturization limits hinder the effectiveness of frame-shaped conductive members.
Innovation Solution
A semiconductor package design featuring a substrate with a semiconductor element surrounded by a frame-shaped or ring-shaped conductive member, where a wiring pattern with a higher electrostatic coupling capacity is integrated to enhance electromagnetic shielding by capacitive coupling, effectively reducing the impact of external electromagnetic waves on the semiconductor circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a frame-shaped conductive member is used for electromagnetic shielding, then shielding effectiveness is improved in the frequency range of several kHz to several MHz, but shielding capabilities degrade in the frequency range of several hundred MHz to several GHz
Solution Approach 1:
The patent introduces a wiring pattern with optimized electrostatic coupling capacity to the conductive member, changing the electrical parameters of the shielding structure. This modification enables the system to maintain effective electromagnetic shielding across a broader frequency range including several hundred MHz to several GHz, where conventional frame-shaped conductors alone are insufficient.
2Reliability
If the frame-shaped conductive member is miniaturized to handle higher frequency bands, then shielding at higher frequencies is improved, but the semiconductor elements cannot be miniaturized further due to physical limits
Solution Approach 1:
The patent combines the frame-shaped conductive member with a specifically designed wiring pattern that has optimized electrostatic coupling capacity. This composite structure integrates two functional elements working together: the conductive member provides basic shielding while the wiring pattern enhances high-frequency performance, achieving effective shielding without requiring further miniaturization of the conductive member.
3Reliability
If electrostatic coupling capacity between conductive member and wiring pattern is increased, then electromagnetic shielding is improved, but electric field intensity within the package increases
Solution Approach 1:
The patent optimizes the electrostatic coupling capacity parameter to achieve a balance between shielding effectiveness and electric field control. By carefully designing the wiring pattern's coupling capacity, the system achieves improved electromagnetic immunity while maintaining acceptable electric field intensity levels within the package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves the semiconductor package's immunity to electromagnetic interference by maintaining effective shielding across a broader frequency range, reducing the electric field intensity within the package, and stabilizing the power source voltage, thereby ensuring stable operation.
Implementation Method 1
a conductive member having a frame shape or ring shape, disposed on the surface of the substrate to which the semiconductor element has been mounted by way of the dielectric member, such that the semiconductor element is exposed from an opening portion of the frame shape or ring shape
Implementation Method 2
An electrostatic coupling capacity value between the conductive member and the wiring pattern is not less than an electrostatic coupling capacity value between the conductive member and the signal wiring layer
Implementation Method 3
a dielectric member, a conductive member having a frame shape or ring shape, disposed on the surface of the substrate to which the semiconductor element has been mounted by way of the dielectric member
Data Source
AI summary
A semiconductor package having a metal frame includes a frame-shaped conductive member which has an opening portion, mounted on a substrate, and a semiconductor element disposed within the opening. A ring-shaped wiring pattern is provided on a portion of the substrate outwards from the opening portion of the conductive member. The electrostatic coupling capacity of the ring-shaped wiring pattern and the conductive member is not less than the electrostatic coupling capacity of a semiconductor metal wiring layer and the conductive member. The ring-shaped wiring pattern and the ground wiring of the semiconductor metal wiring layer are electrically connected.