Stacked Semiconductor Package Shielding Member for EMI Suppression
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Solution Overview
Problem
Electronic devices suffer from electromagnetic interference (EMI) due to radiated or conducted emissions, which can disrupt the operation of adjacent devices and reduce overall performance, particularly in small and mobile devices with high performance requirements.
Innovation Solution
A semiconductor package with a package-on-package structure, featuring a shielding member that covers the top and side surfaces of the packages, including a metal or soft magnetic material layer, and exposed ground lines at the edges of the wiring boards to connect with the shielding member, effectively reducing electromagnetic interference by providing a direct contact point for the shielding member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multi-chip stacked package or system in package techniques are used to achieve high performance and small size, then device performance and integration are improved, but electromagnetic interference increases due to closer proximity of multiple chips
Solution Approach 1:
A shielding member is introduced as an intermediary element between the lower and upper packages. This shielding member includes a ground terminal that contacts the lower package and a ground line that contacts the upper package, acting as a mediator to redirect electromagnetic interference to ground potential, thereby protecting the signal lines while maintaining the stacked package configuration
Solution Approach 2:
The harmful electromagnetic interference is extracted and redirected away from the signal paths by providing dedicated ground lines and ground terminals that channel the interference to ground potential, separating the harmful electromagnetic effects from the functional signal transmission paths
2Adaptability or versatility
If multiple signal lines are densely packed in stacked packages to increase functionality, then device integration is improved, but electromagnetic interference between adjacent signal lines increases
Solution Approach 1:
Ground lines are introduced as intermediary elements between adjacent signal lines in the stacked package structure. These ground lines act as shields that redirect electromagnetic interference generated by dense signal line packing to ground potential, enabling high-density signal routing while maintaining signal integrity
3Adaptability or versatility
If package thickness is increased to accommodate multiple chips in stacked configuration, then device integration is improved, but shielding effectiveness becomes more difficult to achieve
Solution Approach 1:
The shielding approach transitions from attempting to shield the entire thick package volume to creating localized shielding planes at specific heights within the package structure. Ground terminals and ground lines are positioned at strategic locations to create effective shielding planes that work within the constrained vertical space of the stacked package
Solution Approach 2:
Ground terminals and ground lines serve as intermediary shielding elements that bridge the lower and upper packages. These intermediaries provide continuous ground reference planes that maintain shielding effectiveness across the vertical distance between stacked packages, enabling protection despite increased package thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The semiconductor package effectively suppresses internal and external electromagnetic interference, enhancing operational reliability, signal integrity, and power management while preventing malfunctions, thus ensuring reliable performance in high-performance, small-sized electronic devices.
Implementation Method 1
a shielding member covering a top surface and a side surface of a structure including the first and second packages and the shielding member is disposed on the at least one ground terminal
Implementation Method 2
at least one ground terminal connecting a plurality of ground lines, which may be disposed in the first and second wiring boards, respectively, with each other
Data Source
AI summary
A semiconductor package includes a first package including a first wiring board and at least one first semiconductor chip mounted on the first wiring board, a second package stacked on the first package. The second package includes a second wiring board and at least one second semiconductor chip mounted on the second wiring board. The semiconductor package further includes at least one connection terminal connecting a plurality of signal lines of the first and second wiring boards, respectively, with each other. The semiconductor package further includes at least one ground terminal connecting a plurality of ground lines of the first and second wiring boards, respectively, with each other, and includes a side surface, and a shielding member covering a top surface and a side surface of a structure including the first and second packages and the shielding member is disposed on the at least one ground terminal.