Semiconductor Package Shielding Layer Fabrication
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Solution Overview
Problem
Conventional semiconductor packages face challenges with electromagnetic interference due to close mounting of devices on a motherboard, leading to the need for effective shielding methods to prevent electromagnetic waves from interfering with device operation.
Innovation Solution
A semiconductor package fabrication method involving the formation of a substrate, attachment of semiconductor devices, encapsulation with an encapsulant, and the creation of a shielding layer on the encapsulant's surface to shield electromagnetic waves, eliminating the need for adhesive tape and thus preventing tape burrs and delamination issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive tape is used to hold multiple semiconductor devices during fabrication, then the devices can be positioned and processed together, but tape burrs and delamination occur causing reliability issues
Solution Approach 1:
The patent removes the adhesive tape from the fabrication process entirely. Instead of using tape to hold semiconductor devices during encapsulation, the process directly encapsulates the devices on the substrate. This extraction of the problematic adhesive tape eliminates the source of tape burrs and delamination while maintaining the ability to process multiple devices together through direct encapsulation molding.
Solution Approach 2:
The patent introduces a release layer as an intermediary between the substrate and the encapsulant. This release layer allows the encapsulant to be molded directly onto the substrate without requiring adhesive tape, and enables clean separation after encapsulation. The release layer mediates the interaction between the substrate and encapsulant, preventing direct adhesion issues while maintaining processability.
2Area of stationary object
If semiconductor devices are mounted closely together on a motherboard, then space utilization is improved, but electromagnetic interference occurs between devices
Solution Approach 1:
The patent divides the encapsulant into separate encapsulation regions for each semiconductor device. These regions are separated by gaps or trenches that act as physical barriers to electromagnetic interference. By segmenting the encapsulation structure, the patent maintains close device spacing for space efficiency while introducing isolation barriers that prevent electromagnetic coupling between adjacent devices.
Solution Approach 2:
The patent converts the harmful electromagnetic waves into beneficial reflected signals by incorporating electromagnetic shielding layers within the encapsulant structure. These shielding layers, positioned at strategic locations, reflect electromagnetic waves back toward the source or guide them along controlled paths, transforming the harmful interference into a contained electromagnetic environment that does not affect adjacent devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields electromagnetic waves, enhancing the reliability of the semiconductor package by preventing external interference and ensuring proper adhesion and removal of adhesive tapes without residue or backspill phenomena.
Implementation Method 1
forming a shielding layer on a surface of the encapsulant to shield electromagnetic waves
Data Source
AI summary
A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.