Semiconductor Package Shielding Layer EMI Reduction
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Solution Overview
Problem
As semiconductor devices become more complex and smaller in size, they experience higher electromagnetic interference (EMI) due to increased electromagnetic emissions, which can adversely affect neighboring devices, and existing shielding methods may not adequately address this issue.
Innovation Solution
A semiconductor package device is designed with a shielding layer electrically connected to a grounding element, along with an insulating film and interconnection elements, to effectively reduce EMI by preventing electromagnetic emissions from passing through and causing short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding layer is added to reduce EMI, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The shielding layer is integrated with the package body structure, forming a unified component rather than a separate addition. The conductive shielding layer is embedded within the package body during the molding process, merging the shielding function with the structural housing to reduce overall device complexity while maintaining EMI protection.
Solution Approach 2:
The package body serves multiple functions: it provides mechanical protection, structural support, and electromagnetic shielding. By incorporating the shielding layer into the package body, the housing becomes a multi-functional component that simultaneously performs structural and EMI protection roles, reducing the need for additional separate shielding components.
2Object-affected harmful factors
If the shielding layer is electrically connected to the grounding element, then EMI reduction is improved, but the risk of short circuit with interconnection elements increases
Solution Approach 1:
An insulating layer is introduced as an intermediary between the conductive shielding layer and the interconnection elements. This insulating layer prevents direct electrical contact and potential short circuits while allowing the shielding layer to remain electrically connected to the grounding element through designated pathways, thus maintaining EMI protection without compromising reliability.
Solution Approach 2:
The insulating properties are applied locally at critical interfaces where the shielding layer approaches interconnection elements. Rather than making the entire shielding layer insulating (which would reduce shielding effectiveness), the insulating material is strategically placed only where needed to prevent short circuits, maintaining both EMI protection and electrical reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces electromagnetic interference by ensuring the shielding layer is properly connected to the grounding element and isolated from interconnection elements, enhancing the reliability and manufacturing efficiency of semiconductor packages.
Implementation Method 1
When electromagnetic emissions from an interior of the package strike an inner surface of the casing, at least a portion of these emissions can be electrically shorted, thereby reducing the level of emissions that can pass through the casing and adversely affect neighboring semiconductor devices.
Data Source
AI summary
A semiconductor package device includes a substrate, a die, a package body, a shielding layer, a solder mask layer, an insulating film and an interconnection element. The die is disposed on a top surface of the substrate. The package body is disposed on the top surface of the substrate to cover the die. The shielding layer is disposed on the package body and is electrically connected to a grounding element of the substrate. The solder mask layer is disposed on a bottom surface of the substrate. The insulating film is disposed on the solder mask layer. The interconnection element is disposed on the bottom surface of the substrate. A first portion of the interconnection element is covered by the insulating film, and a second portion of the interconnection element is exposed from the insulating film.