Semiconductor Package Shielding Layer Design
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Solution Overview
Problem
Existing semiconductor packages face challenges in miniaturization and lightweight design due to the need for electromagnetic shielding, which is hindered by the space required for metal shields and the inability of encapsulant materials to effectively protect against electromagnetic interference.
Innovation Solution
A semiconductor package design featuring a first and second substrate with ground conductors, a molded portion encapsulating electronic elements, and a shielding layer connected to the second ground conductor on the second substrate, which provides effective electromagnetic shielding without compromising miniaturization or lightness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal shield can is used to protect internal ICs from electromagnetic waves, then electromagnetic shielding is improved, but the package size and weight increase due to the space required for the shield can
Solution Approach 1:
The patent merges the shielding function with the existing substrate structure by forming a shielding layer directly on the second substrate that accommodates electronic elements. This integration eliminates the need for a separate shield can structure, achieving electromagnetic shielding while maintaining compact package dimensions.
Solution Approach 2:
The patent employs a thin shielding layer formed on the second substrate instead of a bulky metal shield can. This thin film approach provides effective electromagnetic shielding while minimizing the space required, enabling miniaturization of the semiconductor package.
2Object-affected harmful factors
If a metal shield can is used to protect internal ICs from electromagnetic waves, then electromagnetic shielding is improved, but the package weight increases due to the metal shield material
Solution Approach 1:
The patent uses a thin shielding layer formed on the second substrate, which significantly reduces the weight compared to a traditional metal shield can. This thin film structure provides adequate electromagnetic shielding while enabling lightweight package design.
Solution Approach 2:
The patent employs composite material structures where the shielding layer is integrated with the substrate material. This composite approach achieves effective shielding with reduced weight by optimizing the material composition and structure rather than using solid metal throughout.
3Volume of moving object
If an epoxy encapsulant material is used instead of a shield can, then miniaturization is improved, but electromagnetic shielding capability deteriorates as the mold cannot effectively protect against electromagnetic waves
Solution Approach 1:
The patent combines the epoxy encapsulant material with a conductive shielding layer to create a composite structure. The epoxy provides mechanical protection and encapsulation while the integrated shielding layer provides electromagnetic wave protection, achieving both miniaturization and effective shielding.
Solution Approach 2:
The patent merges the encapsulation function of the epoxy mold with the shielding function by integrating a shielding layer within the encapsulant structure. This combination allows the single component to fulfill both protective roles, enabling compact design without sacrificing electromagnetic shielding capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances electromagnetic shielding while allowing for the miniaturization and lightweight design of semiconductor packages by effectively protecting internal elements from electromagnetic interference using a shielding layer connected to the second ground conductor.
Implementation Method 1
a shielding layer formed on outer surfaces of the molded portion and the first substrate and at least a portion of a side surface of the second substrate to shield electromagnetic waves
Implementation Method 2
a second ground conductor connected to the first ground conductor... wherein the shielding layer is connected to the second ground conductor of the second substrate
Data Source
AI summary
A semiconductor package includes: a first substrate including a first ground conductor disposed on at least a second surface of a first surface and the second surface; a plurality of electronic elements mounted on the first surface and the second surface of the first substrate; a second substrate adhered to the second surface of the first substrate and including a penetration part formed to accommodate the plurality of electronic elements mounted on the second surface of the first substrate and a second ground conductor connected to the first ground conductor; a molded portion encapsulating the plurality of electronic elements mounted on the first surface of the first substrate; and a shielding layer formed on outer surfaces of the molded portion and the first substrate and at least a portion of a side surface of the second substrate to shield electromagnetic waves.