Semiconductor Package Shielding Layout for Dense EMI Control
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Solution Overview
Problem
Interference between adjacent electronic components in semiconductor package structures affects performance, necessitating an effective shielding solution to mitigate these interactions.
Innovation Solution
A semiconductor package structure incorporating a device package with a shielding layer disposed on its surfaces, featuring a multi-layered shielding design that includes a conductive thin film and a protective layer to reduce thickness and enhance protection, along with a method of manufacturing that involves mass transferring device packages and forming a shielding material layer between them to maintain uniform spacing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shielding structure is added to reduce interference between adjacent electronic components, then shielding effectiveness is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple shielding layers (conductive thin film layer and shielding layer) into a single integrated shielding structure that is formed simultaneously with the device package structure. This merging approach provides comprehensive shielding effectiveness while reducing the number of separate components and assembly steps, thereby resolving the contradiction between shielding effectiveness and device complexity.
Solution Approach 2:
The shielding structure is formed in advance during the manufacturing process before the device packages are assembled. The conductive thin film layer and shielding layer are deposited and patterned onto the carrier substrate prior to device mounting, which simplifies the overall manufacturing process and reduces complexity compared to adding shielding structures after assembly.
2Productivity
If device packages are arranged closely to increase productivity, then manufacturing efficiency is improved, but interference between adjacent components worsens
Solution Approach 1:
The patent introduces a shielding layer as an intermediary element between adjacent device packages. This shielding layer acts as a mediator that blocks electromagnetic interference between closely spaced packages, enabling high-density arrangement without compromising performance. The shielding layer is formed as part of the carrier substrate structure, allowing packages to be mounted in close proximity while maintaining shielding effectiveness.
3Reliability
If a thick shielding layer is used to enhance protection, then shielding effectiveness is improved, but device size increases
Solution Approach 1:
The patent employs a composite shielding structure consisting of a conductive thin film layer and a shielding layer made of conductive material. This composite approach provides effective shielding with reduced thickness compared to using a single thick layer. The combination of different conductive materials and structures optimizes shielding performance while minimizing the volume occupied by the shielding structure.
Data Source
AI summary
A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.