Semiconductor Package Shielding Members for EMI Radiation Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face limitations in shielding electromagnetic interference (EMI) when mounted on printed circuit boards due to the space between the package and the board, which restricts effective EMI radiation shielding.
Innovation Solution
A semiconductor package design featuring a redistribution layer with multiple shielding members, including shield-dams of predetermined lengths, is introduced to surround the electrical connection metal bumps, enhancing EMI shielding by creating a larger shielding area and improving board-level reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a package is mounted on a PCB through solder balls or lands, then electrical connection is achieved, but a space exists between the PCB and package that limits EMI shielding effectiveness
Solution Approach 1:
The shielding structure is divided into multiple segments: solder balls/lands for electrical connection, shield dams extending from the package body, and shielding members on the PCB. This segmentation allows each component to perform its specific function while collectively achieving comprehensive EMI shielding.
Solution Approach 2:
The shielding structure extends from a two-dimensional plane to three-dimensional space by adding vertical shield dams that extend upward from the PCB surface and connect to the package body, creating a multi-layered shielding barrier that blocks EMI radiation paths.
2Reliability
If shielding members with shield-dams are introduced to surround electrical connection metal bumps, then EMI shielding area is increased, but device complexity increases
Solution Approach 1:
The shield dams are integrated with the existing solder balls or lands, merging the electrical connection function with the EMI shielding function into a single unified structure, thereby reducing overall device complexity while maintaining shielding effectiveness.
Solution Approach 2:
The shielding members serve multiple functions: they provide EMI shielding, maintain electrical connection through solder joints, and structurally surround the electrical connection metal bumps. This multi-functionality reduces the need for separate components.
3Object-affected harmful factors
If multiple shielding members with staggered gaps are used to surround electrical connections, then EMI radiation is reduced, but manufacturing complexity increases
Solution Approach 1:
The shielding members are arranged in a periodic pattern with regular intervals and staggered gaps, creating a consistent shielding effect throughout the structure. This periodic arrangement simplifies manufacturing by allowing standardized production and assembly processes.
Data Source
AI summary
A semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, an encapsulant disposed to cover at least a portion of the semiconductor chip, and a connection member including a redistribution layer. The redistribution layer includes a plurality of first pads, a plurality of second pads surrounding the plurality of first pads, and a plurality of third pads surrounding the plurality of second pads. Each of the plurality of second pads and each of the plurality of third pads have shapes different from a shape of each of the plurality of first pads. Gaps between the plurality of second pads and gaps between the plurality of third pads are staggered with each other.