Semiconductor Package EMI Shielding via Reinforcing Vias
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Solution Overview
Problem
The existing semiconductor package technologies face challenges with increased electromagnetic interference (EMI) and reduced structural rigidity due to the large mounting area and distance between components, which affects reliability, especially in miniaturized packages subjected to thermal and mechanical stress.
Innovation Solution
A semiconductor package design featuring a support member with a through-hole, a metal layer on the sidewall and surfaces, a connection member with a redistribution layer, a semiconductor chip, passive components, and a reinforcing via to enhance EMI shielding and structural integrity by connecting metal layers through a trench via and reinforcing the adhesion between the metal layers and the support member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are mounted on a printed circuit board using COB technology, then individual passive components and semiconductor packages can be mounted, but a large mounting area is required and electromagnetic interference between components increases
Solution Approach 1:
The patent transitions from planar mounting on a PCB to three-dimensional stacking within a support member. Multiple components (semiconductor chip, passive components) are mounted at different heights and positions within the support member's through-holes, utilizing vertical space to reduce the horizontal mounting footprint.
Solution Approach 2:
Components are nested within the support member structure. The semiconductor chip and passive components are positioned inside through-holes of the support member, with the encapsulant surrounding and protecting them, creating a compact nested arrangement that minimizes overall package size.
2Ease of manufacture
If components are mounted using COB technology, then component mounting is achieved, but electromagnetic interference between components increases
Solution Approach 1:
The support member is divided into multiple through-holes that physically separate different components. The semiconductor chip is placed in one through-hole while passive components are placed in other through-holes, creating spatial segmentation that reduces electromagnetic interference between them.
Solution Approach 2:
The support member acts as an intermediary structure between components. It provides physical separation and positioning that prevents direct electromagnetic coupling, while still enabling electrical connections through the redistribution layer and connection terminals.
3Adaptability or versatility
If the distance between semiconductor chip and passive component is increased, then component placement flexibility is improved, but electric noise increases
Solution Approach 1:
The support member provides different local environments for different components. Through-holes are positioned and sized to provide optimal spacing for each component type, allowing flexible placement while maintaining controlled distances that minimize noise coupling between specific component pairs.
4Volume of moving object
If miniaturization is applied to semiconductor package, then package size is reduced, but structural rigidity decreases and reliability under thermal load and mechanical shock deteriorates
Solution Approach 1:
The support member uses a composite structure combining the rigid support member material with the encapsulant material. This composite construction provides both miniaturization and maintained structural integrity, as the encapsulant fills and protects internal spaces while the support member provides external rigidity.
Solution Approach 2:
The patent uses vertical stacking within the support member to achieve miniaturization in the horizontal plane. By arranging components in three dimensions rather than spreading them out flat, the package achieves compact size while the vertical arrangement within the rigid support member maintains structural strength.
Data Source
AI summary
A semiconductor package includes a support member having a first surface and a second surface, and having a through-hole, a first metal layer for shielding disposed on an internal sidewall of the through-hole and the first surface and the second surface of the support member, a connection member disposed on the first surface of the support member, and having a redistribution layer, a semiconductor chip disposed in the through-hole, an encapsulant sealing the semiconductor chip located in the through-hole, and covering the second surface of the support member, a second metal layer for shielding disposed on the encapsulant, and connected to the first metal layer for shielding by a connecting trench via passing through the encapsulant, and a reinforcing via disposed in a region, overlapping the trench via for connection, of the support member, and connected to the first metal layer for shielding.