Semiconductor Package EMI Shielding and Warpage Prevention
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Solution Overview
Problem
Conventional semiconductor packages face issues such as excess cost, decreased reliability, inadequate shielding, and large package sizes, which lead to electromagnetic interference (EMI) and potential warpage due to inadequate shielding and manufacturing methods.
Innovation Solution
A semiconductor package design that includes a substrate with electronic devices on both surfaces, covered by moldings and an EMI shielding layer that surrounds the substrate and moldings, with conductive bumps for electrical connectivity, to prevent warpage and shield against EMI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packaging methods are used, then manufacturing simplicity is maintained, but EMI shielding is inadequate and reliability decreases
Solution Approach 1:
The EMI shielding structure is segmented into multiple independent shielding layers positioned at different locations within the package. Each shielding layer can be independently formed and positioned, allowing for modular assembly and reduced manufacturing complexity while achieving comprehensive EMI protection.
Solution Approach 2:
Multiple shielding layers are nested within each other at different levels in the package structure. The shielding layers are positioned between the substrate and molding compound, creating a nested configuration that provides progressive EMI filtering while maintaining a compact overall structure.
2Object-affected harmful factors
If adequate EMI shielding is implemented, then electromagnetic interference is reduced, but package size increases
Solution Approach 1:
EMI shielding is applied locally at critical interfaces within the package rather than as a complete surrounding shield. Shielding layers are positioned specifically between the substrate and molding compound where EMI coupling occurs most strongly, providing effective EMI protection while minimizing additional volume.
Solution Approach 2:
Instead of implementing complete 360-degree EMI shielding, the solution uses partial shielding with multiple layers at strategic locations. This partial action approach provides sufficient EMI protection for the critical internal components without the volume penalty of comprehensive external shielding.
3Object-affected harmful factors
If multiple shielding layers are added, then EMI protection is enhanced, but manufacturing cost increases
Solution Approach 1:
Multiple shielding layers are merged into a single integrated EMI shielding structure that can be formed in one manufacturing step. The shielding layers are combined with the molding compound formation process, eliminating the need for separate assembly steps and reducing overall manufacturing cost despite the enhanced EMI protection.
Solution Approach 2:
The molding compound serves multiple functions: it provides mechanical encapsulation, structural support, and EMI shielding. By making the molding compound itself conductive or by embedding conductive elements within it, the same material performs both packaging and shielding functions, reducing the need for additional dedicated shielding components.
Data Source
AI summary
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.