Semiconductor Package Layout for Chip-to-Pattern Short Isolation

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Solution Overview

Problem

The existing semiconductor packages face issues with durability and reliability due to potential shorts between the packaged chip and the substrate or PCB circuit pattern, which can degrade the product's performance and longevity.

Innovation Solution

The semiconductor package design includes a substrate with a circuit pattern and upper pads on one surface, connected via connection members on the opposite surface, with an upper passivation film exposing these components and a bump supporting a semiconductor chip, ensuring electrical separation and minimizing short circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a flip chip type semiconductor chip is packaged on a substrate, then functionality and integration are improved, but the risk of short circuits between the chip and substrate increases

Engineering Contradiction:

ImprovefunctionalityVSAvoidshort circuit risk

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

An insulating film is introduced as an intermediary layer between the semiconductor chip and the substrate. This insulating film prevents direct electrical contact between conductive elements, thereby eliminating the short circuit risk while maintaining the functional benefits of the flip chip packaging structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The insulating film is applied in advance to the substrate surface before mounting the semiconductor chip. This preliminary protective action prevents potential short circuits from occurring, addressing the reliability issue before the packaging is completed.

Inventive Principle:

Principle #9Preliminary anti-action

2Reliability

If connection members are used to electrically connect the chip and substrate, then electrical connectivity is improved, but the potential for harmful electrical contact increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoidelectrical short

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The insulating film serves as a mediator that allows controlled electrical connections through designated openings while preventing unwanted electrical contact in other areas. This enables necessary connectivity while blocking harmful short circuits.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The insulating film is applied globally across the substrate surface, but electrical connectivity is provided locally through specific openings or contact regions. This local quality approach ensures connectivity where needed while maintaining insulation where required to prevent shorts.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS20250062212A1Semiconductor packages and electronic devices including the same

Publication Date: 2025.02.20 SAMSUNG ELECTRONICS CO LTD

AI summary

There is provided a semiconductor package comprising: a substrate that includes a first surface and a second surface, wherein the second surface is opposite to the first surface; a first connection member and a second connection member on the second surface of the substrate; an upper pad on the first surface of the substrate, wherein the upper pad is electrically connected to the first connection member; a circuit pattern on the first surface of the substrate, wherein the circuit pattern is electrically connected to the second connection member; an upper passivation film on the first surface of the substrate, wherein the upper passivation film at least partially exposes the upper pad and the circuit pattern; a bump on the upper pad; and a semiconductor chip on the bump, wherein the circuit pattern is electrically separated from the semiconductor chip.