Semiconductor Package Side Protection Without Carrier Support
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Solution Overview
Problem
Existing semiconductor package manufacturing processes require a carrier to support the wafer during grinding and metallization, leading to higher manufacturing costs.
Innovation Solution
A panel is used to support the wafer during grinding and metallization processes, eliminating the need for a carrier and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a carrier is used to support the wafer during grinding and metallization processes, then the wafer can be properly supported and processed, but the manufacturing cost increases
Solution Approach 1:
The patent removes the carrier component from the manufacturing process entirely. By using a panel-based support system instead of a carrier, the invention extracts the unnecessary carrier element that increases cost and complexity, while still providing the required wafer support function during grinding and metallization processes
Solution Approach 2:
The panel serves multiple functions: it supports the wafer during grinding, provides support during metallization processes, and enables cost reduction by eliminating the need for separate carriers. This multi-functional approach consolidates the support role into a single, reusable panel structure
2Reliability
If a thin substrate is used to reduce resistance, then electrical performance improves, but the substrate becomes more fragile and difficult to handle
Solution Approach 1:
The patent applies a molding encapsulation that completely surrounds and protects the thin substrate before the product is put into service. This protective encapsulation acts as beforehand cushioning, preventing mechanical damage to the fragile thin substrate while allowing the substrate to maintain its thin profile for optimal electrical performance
Solution Approach 2:
The invention combines the thin semiconductor substrate with a protective molding encapsulation material to create a composite structure. The substrate provides electrical performance while the encapsulation material provides mechanical strength and protection, creating a synergistic combination that addresses both electrical and mechanical requirements
3Reliability
If a thick plated metal layer is used to reduce resistance, then electrical performance improves, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The patent combines the metallization process with the panel support structure, where the panel serves as the base for direct metal deposition. This merging of functions allows the plated metal layer to be applied directly onto the panel-supported substrate, simplifying the overall metallization process while enabling thick metal layers for optimal electrical performance
4Reliability
If the molding encapsulation provides comprehensive side protection, then product reliability improves, but the manufacturing process time increases
Solution Approach 1:
The patent positions and secures the wafer onto the panel before initiating the molding encapsulation process. This preliminary action ensures that the wafer is properly positioned and stable, allowing the molding material to be applied continuously and efficiently in a single operation, providing comprehensive side protection without requiring multiple separate steps that would increase manufacturing cycle time
Data Source
AI summary
A semiconductor package comprises a semiconductor substrate, a plurality of contact pads, a plated metal layer, and a molding encapsulation. The molding encapsulation directly contacts an entirety of each side surface of a plurality of side surfaces of the semiconductor substrate, and an entirety of each side surface of a plurality of side surfaces of the plated metal layer. A method comprises the steps of providing a semiconductor device wafer; applying a first thinning process; applying a dicing process; attaching a panel; forming a first molding encapsulation; applying a second thinning process, forming a plurality of plated metal sections, removing the panel, and applying a singulation process.