Semiconductor Package Connectors for Shorter Signal Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face limitations in integration density and area efficiency, particularly in large packages where connectors and dies require complex assembly and long signal pathways, leading to signal loss and increased costs.
Innovation Solution
A semiconductor device with integrated connectors directly attached to the package, eliminating the need for a circuit board, featuring a die region, encapsulant, and redistribution structure, where connectors serve as external input/output terminals, reducing signal pathway length and enabling high data transmission rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If connectors are integrated directly onto the semiconductor package, then data transmission rate is improved and assembly complexity is reduced, but device complexity increases
Solution Approach 1:
The patent merges the connector function directly into the semiconductor package by integrating connecting elements onto the package substrate. This eliminates the need for separate circuit board assemblies, shortens signal pathways to improve transmission speed, and reduces overall assembly complexity despite increasing the integrated device's functional complexity.
2Speed
If signal pathways are shortened by eliminating circuit board connections, then data transmission rate is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent transitions from traditional planar circuit board connections to a three-dimensional integrated package structure. Connecting elements are positioned vertically and laterally on the package substrate, creating multiple dimensional pathways that shorten signal distance while distributing precision requirements across multiple fabrication stages rather than a single critical connection point.
3Device complexity
If connectors are integrated onto the package, then assembly complexity is reduced, but area of the package increases
Solution Approach 1:
The patent segments the package area into distinct functional regions: an active die region for computational functions and a peripheral connector region for I/O functions. This segmentation allows the connectors to be positioned in unused peripheral areas, utilizing otherwise wasted space and minimizing the impact on the active device area while simplifying assembly by co-integrating both functions.
Data Source
AI summary
A semiconductor structure includes a die and a first connector. The first connector is disposed on the die. The first connector includes a first connecting housing, a first connecting element and a first connecting portion. The first connecting element is electrically connected to the die and disposed at a first side of the first connecting housing. The first connecting portion is disposed at a second side different from the first side of the first connecting housing, wherein the first connecting portion is one of a hole and a protrusion with respect to a surface of the second side of the first connecting housing.