Integrated Semiconductor Package for Compact Inverter Signal Isolation
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Solution Overview
Problem
Conventional inverter devices for electric vehicles require a large footprint due to the need for multiple semiconductor devices and extensive wiring, which hinders downsizing efforts.
Innovation Solution
A semiconductor device with a compact design that integrates a semiconductor control element, two drive elements, and insulating elements, along with an electroconductive support member and sealing resin, allowing for efficient signal transmission and electrical insulation, thereby reducing the footprint on the wiring board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple semiconductor devices are mounted on the wiring board to drive power semiconductors, then the inverter device can function properly, but the footprint on the wiring board becomes large
Solution Approach 1:
The patent combines a semiconductor control element, multiple drive elements, and insulating elements into a single integrated semiconductor device. This merging eliminates the need for multiple separate devices, reducing the footprint on the wiring board while maintaining the functional capability to drive power semiconductors in a three-phase inverter system
Solution Approach 2:
The integrated semiconductor device performs multiple functions: it contains a control element for signal processing, multiple drive elements for driving different power semiconductors, and insulating elements for electrical isolation. This multi-functionality allows a single device to replace what would traditionally require multiple separate devices, thereby reducing the overall footprint
2Ease of operation
If extensive wiring is used to connect multiple semiconductor devices, then signal transmission is achieved, but the device complexity and space requirements increase
Solution Approach 1:
By integrating the control element and multiple drive elements into a single semiconductor device with internal wiring, the patent eliminates the need for extensive external wiring to connect multiple separate devices. The internal wiring structure within the integrated device simplifies the overall system complexity while maintaining proper signal transmission pathways
Data Source
AI summary
A semiconductor device includes a semiconductor control element, a first drive element, a second drive element and a first insulating element. The first drive element is spaced apart from the semiconductor control element in a first direction orthogonal to a thickness direction of the semiconductor control element and receives a signal transmitted from the semiconductor control element. The second drive element is spaced apart from the first drive element in a second direction orthogonal to the thickness direction and the first direction and receives a signal transmitted from the semiconductor control element. The first insulating element is located between the semiconductor control element and the first drive element in the first direction. The first insulating element relays a signal transmitted from the semiconductor control element to the first drive element and provides electrical insulation between the semiconductor control element and the first drive element.