Semiconductor Package with Embedded Silicon Reinforcing Member
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing manufacturing methods for fan-out chip-scale semiconductor packages require multiple resin-encapsulation processes, leading to increased costs, potential cracking or chipping of semiconductor chips, and weak adhesion issues between seal resin layers, due to the use of consumable support carriers and double resin-forming processes.
Innovation Solution
A method involving a support carrier with recesses to encapsulate semiconductor chips with a single resin process, forming a seal resin part that extends outside the chip, incorporating rewiring patterns and solder resist, and using reinforcing members to maintain structural integrity, allowing for external connection terminals and reducing the need for multiple resin-forming steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a consumable support carrier is used to arrange semiconductor chips and perform resin encapsulation, then the semiconductor chips can be individualized and arranged separately, but the manufacturing cost increases due to the cost of the support carrier
Solution Approach 1:
The support carrier is designed as a disposable item that is removed after resin encapsulation. By using a low-cost, consumable support carrier that serves its purpose during manufacturing and is then discarded, the patent eliminates the need for expensive reusable carriers while maintaining the ability to arrange and individualize semiconductor chips effectively
Solution Approach 2:
The support carrier is completely removed from the final semiconductor package structure. By extracting the support carrier from the final product and using it only as a temporary manufacturing aid, the patent eliminates its cost from the final product cost while still utilizing it for chip arrangement and encapsulation processes
2Volume of moving object
If the thickness of the seal resin is small to reduce package size, then the fan-out CSP can be more compact, but cracking or chipping may occur in the semiconductor chips after removal of the support carrier
Solution Approach 1:
The support carrier is designed to remain attached to the semiconductor chips during the resin encapsulation process, providing mechanical support and cushioning to the chips. This prevents cracking or chipping from occurring during chip removal, even when the seal resin thickness is minimized for compact packaging
Solution Approach 2:
The support carrier acts as an intermediary between the resin encapsulation process and the semiconductor chips. It provides a stable base that distributes stress during resin curing and chip removal, protecting the chips from damage while allowing the use of thinner seal resin
3Ease of operation
If the resin-encapsulation process is performed twice to form seal resin parts, then the semiconductor chips can be individually encapsulated and then arranged, but adhesion problems occur between the first and second seal resin layers
Solution Approach 1:
The patent combines the individualization and encapsulation processes into a single resin encapsulation step. By arranging all semiconductor chips on the support carrier before encapsulation and performing only one resin-filling and curing process, the patent eliminates the interface between multiple resin layers that would cause adhesion problems
Solution Approach 2:
The support carrier is designed with individual recesses for each semiconductor chip, allowing chips to be arranged separately and individually encapsulated within a single resin encapsulation process. This segmentation enables individual chip handling while maintaining a unified encapsulation process
4Ease of operation
If the resin-encapsulation process is performed twice, then the semiconductor chips can be individually processed, but the process time increases due to multiple resin-filling and curing steps
Solution Approach 1:
The patent merges multiple resin encapsulation steps into a single process by arranging all semiconductor chips on the support carrier before encapsulation. This eliminates the need for separate resin-filling and curing operations for each chip or batch, significantly reducing total process time while maintaining individual chip processing capability
Solution Approach 2:
The semiconductor chips are arranged on the support carrier in their final configuration before the resin encapsulation process begins. This preliminary arrangement eliminates the need for subsequent repositioning or additional encapsulation steps, reducing overall process time while ensuring proper individualization
Data Source
AI summary
Semiconductor chips are placed in recesses of a support carrier with electrode surfaces facing upward in a state where the semiconductor chips are arranged separately from each other. A seal resin part is formed by encapsulating the semiconductor chips by an insulating resin on said support carrier. Rewiring patterns are formed on a top surface of the seal resin part. External connection terminals are formed on the rewiring patterns. Bottom parts of the recesses of the support carrier are removed from the seal resin part while maintaining reinforcing members of the support carrier to be remained. The semiconductor packages are individualized by cutting the seal resin part along an outside of each reinforcing member.