Semiconductor Package Single Lead Signal Distribution
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Solution Overview
Problem
There is a demand for smaller, thinner, and lighter semiconductor devices that require higher integration density while maintaining reliability, and existing semiconductor packages face challenges in providing uniform signal distribution to multiple cell regions without voltage drop or signal delay.
Innovation Solution
A semiconductor package design that uses a single lead to deliver power or signals to multiple cell regions, with conductive pads connected to the lead, eliminating the need for internal interconnections and allowing for symmetric placement of cell regions, thereby minimizing voltage drop and signal delay.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple leads are used to provide signals to multiple cell regions, then signal distribution is improved, but device complexity and footprint increase
Solution Approach 1:
A single lead structure is designed to serve multiple functions by providing signals to multiple cell regions simultaneously. The lead extends across the substrate and makes contact with multiple conductive pads that are electrically connected to different cell regions, allowing one lead to replace what would traditionally require multiple separate leads.
Solution Approach 2:
Multiple signal delivery functions are merged into a single lead structure. Instead of having separate leads for each cell region, the patent combines these functions by having one lead that branches or extends to contact multiple pads, thereby reducing the overall number of leads and simplifying the interconnection structure.
2Reliability
If internal interconnections are added to connect cell regions, then signal transmission is improved, but chip size increases
Solution Approach 1:
The signal distribution function is extracted from the chip's internal interconnection structure and relocated to the external lead structure on the substrate. By moving the signal routing function to the substrate level rather than keeping it within the chip, the chip's internal complexity and area requirements are reduced.
Solution Approach 2:
The signal distribution problem is solved by transitioning from a two-dimensional planar interconnection approach within the chip to a three-dimensional structure where leads extend on the substrate beneath and around the chip, providing signal paths that do not consume chip area.
3Productivity
If cell regions are placed close together for high density, then integration density is improved, but signal uniformity deteriorates
Solution Approach 1:
Conductive pads are introduced as intermediary elements between the lead and the cell regions. These pads act as signal distribution nodes that ensure uniform signal delivery to closely spaced cell regions by providing localized electrical contact points that maintain signal integrity regardless of the proximity of the cell regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient signal transmission to multiple cell regions without internal interconnections, reducing the size of the semiconductor chip and enhancing integration density while maintaining reliable performance.
Implementation Method 1
a substrate including a base layer, first and second conductive leads extending along the base layer... whereby the first cell region and the second cell region will both receive a signal transmitted to the second conductive lead from an outside source
Data Source
AI summary
A semiconductor package has an interconnection substrate including a first conductive lead and a second longer conductive lead, and a semiconductor chip including a first cell region, a second cell region, a first conductive pad electrically connected to the first cell region and a second conductive pad electrically connected to the second cell region. The semiconductor chip is mounted to the interconnection substrate with the first and second conductive pads both disposed on and connected to the second conductive lead.