Multi-Faced Semiconductor Package Singulation Without Die Chipping

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Solution Overview

Problem

Conventional semiconductor package manufacturing methods, particularly sawing techniques, lead to increased risk of damage to semiconductor dies due to chipping and cracking, limiting the ability to produce non-rectangular shapes and compromising package reliability.

Innovation Solution

Employing etching techniques to form notches in semiconductor wafers, followed by application of mold compounds and singulation, which anchors the mold compound to the wafer sides, ensuring comprehensive coverage and protection of the semiconductor dies without chipping or cracking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If sawing techniques are used for singulation, then productivity is improved, but manufacturing precision deteriorates due to chipping and cracking

Engineering Contradiction:

Improvesingulation speedVSAvoiddie integrity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces the mechanical sawing system with a chemical etching system. Instead of using physical saw blades that cause chipping and cracking, the invention uses chemical etchants to remove material and form notches, thereby substituting mechanical action with chemical action to preserve die integrity while maintaining productivity

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical-chemical parameters of the singulation process by using controlled chemical etching conditions (etchant composition, temperature, time) instead of mechanical parameters (saw speed, blade pressure). This parameter change allows precise control over the etching depth and profile to prevent die damage while achieving complete separation

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If conventional molding is used, then ease of manufacture is improved, but reliability deteriorates due to inadequate side coverage

Engineering Contradiction:

Improvemolding process simplicityVSAvoidpackage protection

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent segments the molding process into two distinct stages: first molding to form the basic package structure, and second molding to add protective layers over the notched sides. This segmentation allows each molding stage to serve a specific function, with the second stage specifically addressing the reliability issue of side coverage

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent extends the protective coverage from the traditional top-surface-only dimension to include the vertical side dimensions by forming notches and applying mold compound in the vertical direction. This dimensional extension ensures comprehensive protection of the die from all exposed surfaces

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If rectangular die shapes are used, then ease of manufacture is improved, but adaptability deteriorates due to limited shape options

Engineering Contradiction:

Improvedie fabrication simplicityVSAvoiddie shape variety

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent uses asymmetric photomask patterns and corresponding etching processes to create non-rectangular die shapes with asymmetric notches on specific sides. This allows the die to have irregular shapes that can be optimized for specific applications while maintaining compatibility with standard rectangular wafer processing

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent performs preliminary patterning of the photomask and preliminary etching of notches before final die separation. This preliminary action defines the desired non-rectangular shape early in the process, allowing subsequent steps to follow the pre-established pattern and achieve complex shapes with standard equipment

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances semiconductor package reliability by preventing damage during manufacturing and allows for the production of non-rectangular die shapes, improving overall package integrity and functionality.

Implementation Method 1

etching a plurality of notches into the first side of the wafer using the photoresist layer

Methodology Applied

Scientific EffectEtching:

Implementation Method 2

grinding a second side of the wafer opposite the first side of the wafer to the plurality of notches formed in the first side of the wafer

Methodology Applied

Scientific EffectGrinding: Abrasion

Data Source

PatentUS20250293032A1Multi-faced molded semiconductor package and related methods

Publication Date: 2025.09.18 SEMICON COMPONENTS IND LLC

AI summary

Implementations of a method of forming a semiconductor package may include forming electrical contacts on a first side of a wafer, applying a photoresist layer to the first side of the wafer, patterning the photoresist layer, and etching notches into the first side of the wafer using the photoresist layer. The method may include applying a first mold compound into the notches and over the first side of the wafer, grinding a second side of the wafer opposite the first side of the wafer to the notches formed in the first side of the wafer, applying one of a second mold compound and a laminate resin to a second side of the wafer, and singulating the wafer into semiconductor packages. Six sides of a die included in each semiconductor package may be covered by one of the first mold compound, the second mold compound, and the laminate resin.