Semiconductor Package Encapsulation That Protects Solder Bumps
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Solution Overview
Problem
The existing multi-side molding techniques for semiconductor device packages often deform or damage connection elements, such as solder bumps, which can adversely affect the performance of the semiconductor device package.
Innovation Solution
The semiconductor device package design includes a first substrate with a defined space, a second substrate adjacent to the first substrate and covering the space, and an encapsulant that encapsulates both substrates and electronic components, with a conductive layer disposed on the encapsulant and substrates to ensure electrical connectivity without deforming connection elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multi-side molding technique is used to encapsulate components on both sides of the substrate, then encapsulation completeness is improved, but connection elements may be deformed or damaged
Solution Approach 1:
The encapsulation process is divided into two separate stages: first molding one side of the substrate, then molding the other side. This segmentation allows each molding operation to focus on a single side, reducing the risk of deforming connection elements while still achieving complete encapsulation of both sides.
Solution Approach 2:
The first molding operation is performed as a preliminary action before the second molding operation. By completing the encapsulation of the first side before attaching and molding the second side, the connection elements are protected from potential deformation that could occur if both sides were molded simultaneously or in reverse sequence.
2Reliability
If connection elements are used to connect frame board to substrate, then electrical connectivity is improved, but connection elements are susceptible to deformation during molding
Solution Approach 1:
The frame board is attached to the substrate and the first molding operation is completed before the second molding operation. This preliminary action sequence ensures that connection elements are already in place and protected during the first molding, reducing their exposure to deformation risks during the overall manufacturing process.
Solution Approach 2:
The encapsulant material acts as a cushioning medium that protects connection elements from deformation forces during the molding process. By having the encapsulant in place before the second molding operation, it provides a protective environment that reduces stress on the connection elements.
Data Source
AI summary
At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a first substrate with a first surface and a second surface opposite to the first surface, a second substrate adjacent to the first surface of the first substrate, and an encapsulant encapsulating the first substrate and the second substrate. The first substrate defines a space. The second substrate covers the space. The second surface of the first substrate is exposed by the encapsulant. A surface of the encapsulant is coplanar with the second surface of the first substrate or protrudes beyond the second surface of the first substrate.