Semiconductor Package Grounding Structure With Soldered Metal Piece

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Solution Overview

Problem

Current semiconductor package structures experience an unfirm connection between the grounding body and the grounding layer of the substrate, which is prone to corrosion.

Innovation Solution

A manufacturing method for a semiconductor package structure involves providing a substrate with a mounting surface and grounding pads, mounting semiconductor devices and metal pieces connected to the grounding pads, forming a plastic package body and electromagnetic shielding layer, exposing the metal piece surface, and soldering a grounding body to the metal piece.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a grounding body is stuck to a surface of an electromagnetic shielding layer through a copper foil tape, then the grounding connection can be formed, but the connection is not firm and is easily corroded

Engineering Contradiction:

Improvegrounding connection reliabilityVSAvoidconnection strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent replaces the mechanical sticking connection (copper foil tape adhesive bonding) with a metallurgical bonding method (soldering). The grounding body is soldered directly to the grounding pad through the plastic package body, transforming the connection mechanism from mechanical/adhesive to metallurgical, which provides stronger and more corrosion-resistant bonding.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces the plastic package body as an intermediary conductive path. Instead of directly connecting the grounding body to the electromagnetic shielding layer, the grounding body is connected through the grounding pad and the plastic package body (which contains conductive fillers), creating a more reliable multi-path connection that improves both strength and corrosion resistance.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the grounding body is connected through copper foil tape to the electromagnetic shielding layer, then grounding can be achieved, but the connection is prone to corrosion

Engineering Contradiction:

Improvegrounding connection reliabilityVSAvoidcorrosion resistance

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the copper foil tape adhesive bonding system with a soldering metallurgical bonding system. Soldering creates a diffusion-bonded joint that is more resistant to corrosion compared to adhesive bonding, eliminating the corrosion-prone interface between tape and grounding surfaces.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes composite materials in the plastic package body (containing conductive fillers like metal particles or fibers embedded in plastic matrix) to create a corrosion-resistant conductive path. This composite structure provides both electrical conductivity and corrosion resistance, replacing the copper foil tape that is susceptible to oxidation and corrosion.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances the strength and corrosion resistance of the connection between the grounding body and the substrate, improving the reliability and integrity of the electromagnetic shielding.

Implementation Method 1

forming an electromagnetic shielding layer that covers the plastic package body and side surfaces of the substrate

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

mounting a grounding body to the surface of the metal piece through soldering technology

Methodology Applied

Scientific EffectSoldering: Soldering

Implementation Method 3

the electromagnetic shielding layer is formed by sputtering, spraying, electroplating, or coating

Methodology Applied

Scientific EffectSputtering: Sputtering

Data Source

PatentUS20250132266A1Method of manufacturing semiconductor package structure and semiconductor package structure

Publication Date: 2025.04.24 HUANWEI ELECTRONICS SHANGHAI CO LTD

AI summary

A semiconductor package structure and a method of manufacturing the same are provided. The method includes: providing a substrate having a mounting surface and at least one grounding pad; mounting a semiconductor device onto the mounting surface; mounting at least a metal piece onto the mounting surface, wherein the metal piece is electrically connected to the grounding pad; forming a plastic package body, which covers the semiconductor device and the metal piece; forming an electromagnetic shielding layer, which covers the plastic package body and side surfaces of the substrate; exposing a surface of the metal piece; and attaching a grounding body to the surface of the metal piece through soldering. The semiconductor package structure and the method of manufacturing the same achieve high connection strength and high corrosion-resistance between the grounding body in the semiconductor package structure and the grounding pad of the substrate.