3D Semiconductor Package With Spaced Memory Stacks
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Solution Overview
Problem
Current semiconductor packages face limitations in achieving high data processing capacity due to the constraints of semiconductor integration technology, requiring multiple chips to meet demands for operational accuracy, speed, size, and cost, while also struggling with signal path length and heat dissipation.
Innovation Solution
A semiconductor package design featuring a package substrate with multiple memory stacks spaced apart and a processor chip partially overlapping each stack, along with heat dissipation structures on the memory stacks, reduces signal path length, increases input/output lines through a molding layer, and enhances heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor chips are used to increase data processing capacity, then operational accuracy and speed are improved, but signal path length increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from a planar arrangement of multiple chips to a three-dimensional stacked configuration. Memory stacks are arranged vertically above the processor chip, utilizing the vertical dimension to reduce horizontal signal path length while maintaining high data processing capacity through multiple stacked components.
Solution Approach 2:
The patent implements a nested structure where memory stacks are positioned within the vertical space above the processor chip. The processor chip serves as the base layer, with memory stacks nested vertically above it, creating a compact integrated structure that reduces overall package size and signal path length.
2Productivity
If multiple semiconductor chips are used to increase data processing capacity, then operational accuracy and speed are improved, but heat generation increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent extracts the heat dissipation function as a separate, dedicated component. Heat dissipation structures are positioned in direct contact with the processor chip and memory stacks, specifically designed to conduct and dissipate heat away from the active components, thereby managing thermal generation from high-capacity processing.
Solution Approach 2:
The patent introduces heat dissipation structures as intermediary thermal management components between the heat-generating processor chip and the surrounding environment. These structures act as thermal conduits that facilitate heat transfer away from critical components, enabling sustained high-performance operation.
3Productivity
If multiple semiconductor chips are used to increase data processing capacity, then operational accuracy and speed are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges multiple functional components into a single integrated package structure. The processor chip, multiple memory stacks, and heat dissipation structures are combined into one cohesive unit with standardized interconnections, reducing the need for additional external electrical connections and simplifying the overall system architecture.
Solution Approach 2:
The patent creates a universal package structure that can accommodate different configurations of processor chips and memory stacks. The standardized substrate and interconnection design allow the same basic architecture to support various data processing capacities, reducing manufacturing complexity across different product variants.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces power consumption, increases bandwidth, and improves overall performance by shortening signal paths and stabilizing power reception, while eliminating the need for additional electrical connections like silicon interposers and effectively managing heat generation.
Implementation Method 1
at least one heat dissipation structure disposed on the upper surfaces of the memory stacks
Data Source
AI summary
A semiconductor package includes a package substrate, a plurality of memory stacks, at least one processor chip and one or more heat dissipation structures. The memory stacks are disposed on the package substrate. The memory stacks are spaced apart from each other by a predetermined distance. The processor chip is disposed on the memory stacks to be partially overlapped with each of the memory stacks. The heat dissipation structure is disposed on the upper surfaces of the memory stacks.